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Biography
John H. Lau is a senior special project assistant at Unimicron Technology Corporation, Taoyuan City,
Taiwan (ROC). He has more than 40 years of R&D and manufacturing experience in semiconductor packaging,
518 peer-reviewed papers, 43 issued and pending US patents, and 23 textbooks. He is an ASME Fellow,
IEEE Fellow, and IMAPS Fellow. He earned a PhD degree from the U. of Illinois at Urbana-Champaign.
Email John_Lau@unimicron.com

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