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Multi-wavelength on-chip coupling of visible light



        By Robert Niffenegger, David Reens  [Lincoln Laboratory, Massachusetts Institute of Technology]
        Jules Stuart, John Chiaverini  [Lincoln Laboratory and Massachusetts Institute of Technology]
        C         oupling multiple wavelengths   light coupling to PICs that enables use in   light to the interface. Moreover, the smaller




                  of visible light into photonic-
                                                                              single-mode waveguides make alignment
                  integrated-circuits (PICs)    demanding environments.       mode sizes of blue light in optical fiber and
        with robust packaging will be critical for   Background               for low-loss coupling more difficult—
        an expanding set of applications from   Because  most  of  the  applications   submicron tolerances are routinely required,
        quantum information processing to biology.   mentioned above can rely on external laser   leading to more stringent specifications
        Optogenetics, for instance, requires light   sources, fiber coupling of laser light into   for initial alignment and maintenance of
        near the  blue end of the visible spectrum   PIC chips is the most typical approach for   that alignment. The latter concern is an
        to stimulate neuronal activity in living   current and near-term devices and systems.   issue, especially in the situations relevant
        tissue and is poised to capitalize on PIC   (Extremely low size, weight, and power   for quantum information processing (QIP)
        capabilities in implantable substrates [1].   quantum sensing applications may be an   applications where extremes of temperature
        Data communication in the visible spectrum   exception, but even these applications   and/or pressure must be endured. Because of
        can lead to higher bandwidth transmission,   will see initial demonstrations with fiber-  these differences when compared to silicon-
        and direct connection to chips can enable   coupled PICs.) Coupling of light from   photonics, approaches to packaging must
        inter-core communication. Phased-array   fiber to silicon-based PICs is a mature   also be different to allow operation in the
        emitter  geometries based on PICs are at   technology, but significant challenges arise   new visible regime.
        the threshold of new display modalities.   when applying the same techniques at   Here we focus on the use of on-chip
        Quantum-information technologies also   wavelengths lower than the typical telecom    visible-light coupling for trapped-ion QIP
        utilize visible light in several different   bands (i.e., wavelengths around 1550nm).   [3], though we believe the techniques
        promising physical implementations, and   While many of the same design principles   described here are broadly applicable to
        photonic integration is key to achieving   and structures can be modified for use in the   many of the applications described above. In
        practical applications for large-scale   visible spectrum, the materials systems and   this technology, individual atomic ions are
        quantum computing, communication,   tighter tolerances that are required in this   held above the surface of a chip via radio-
        and sensing [2]. Each of these disciplines   frequency range render many of the usual   frequency (RF) and direct current (DC)
        has its own use cases—several being in   packaging techniques ineffective. Chief   fields produced by electrodes patterned on
        atypical environments for microelectronics   among these is the unfortunate fact that    the chip. The chip is maintained in ultra-
        and electro-optics, such as in vivo, in   attachment methods employing adhesives   high vacuum (UHV)  to reduce background
        vacuo, at low temperatures, and on moving   at the fiber-chip interface fail for even   pressure that can limit the lifetime of trapped
        platforms. It is, therefore, paramount to   moderate-intensity blue light because of   ions. Laser beams are focused onto the
        develop methodologies for robust  coupling   “yellowing” of the adhesive over time. This   ions to prepare, manipulate, and read out
        of light across the visible spectrum into   yellowing process results in even so-called   their electronic  states, which can be long-
        PICs to continue advancement in these   “ultraviolet (UV)-compatible” epoxies   lived and have relatively long quantum
        areas. Here we describe a potentially   becoming opaque to blue light—in some   coherence times. Recently developed PICs
        broadly applicable technique for visible-  cases this occurs seconds after application of   for laser-beam addressing of ions utilize

















        Figure 1: a) (left) Multiple wavelengths of light edge-coupled into a photonic integrated circuit (PIC) via a fiber-array block. Waveguides route the light to diffractive
        grating couplers that focus the light on ions trapped above the surface of the chip (trap electrodes not shown); b) (right) Observing red light coupling via glass fiber array.
        The chip is 1cm on a side. Inset: detail of red light coupled into the PIC waveguide on chip (top view). The glass fiber array is on the right and red light is visible in an on-
        chip waveguide on the left.

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