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Figure 4: Schematic representation of an integrated atomic vapor cell with gradient-index surface coupling (GISC) to optical fibers.
vacuum feedthroughs and evanescent single-mode optical guidance to visible pl a t fo r m Pho t Pa c k ,” O p t i k
coupling interfaces for: 1) coupling to and NIR spectral range, by innovative Photonik 10, pp. 42–47 (2015).
the atoms in vacuum, and 2) coupling light-matter coupling interfaces, and 7. A. Ter vonen, B. R. West, S.
from waveguides of the host substrate by further development of hermetic Honkanen, “Ion-exchanged glass
to the waveguides of other integrated glass joints for packaging of hybrid waveguide technology: a review,”
chips or optical fibers (Figure 4). quantum systems. Optical Eng., 50(07), 071107, 1–15
The first method is also known as an (2011).
atomic cladding waveguide and has References 8. S-H. Lee, J. Mitchell, W. Welch,
been demonstrated in SiN [9]. For the 1. E. Gibney, “Quantum gold rush: S. Lee, K. Najafi, “Wafer-level
latter, in addition to planar evanescent the private funding pouring into vacuu m / her metic packaging
coupling, the novel gradient index quantum start-ups,” Nature 574, technologies for MEMs,” Proc.,
surface coupling (GISC) scheme [10] 22-24 (2019). Reliability, Packaging, Testing,
can also be implemented. 2. G. Moody, et al., “Roadmap on and Char. of MEMS/MOEMS and
Possible applications of integrated integrated quantum photonics,” Nanodevices IX, (2010).
vapor cells include spectroscopy arXiv:2102.03323v1 [quant-ph] 9. L . S t e r n , B . D e s i a t o v, I .
schemes for absolute stabilization of (2021). Goykhman, et al., “Nanoscale
the laser frequency, atomic vapor-based 3. A. W. Elshaar i, W. Per nice, light– mat ter i nteractions i n
quantum memories and delay lines in K. Srinivasan, et al., “Hybrid atomic cladding waveguides,”
quantum networks [11], and realization integrated quantum photonic Nat. Comm. 4, 1548 (2013).
of integrated non-reciprocal [12] optical circuits,” Nat. Photonics 14, 285– 10. J. Schwietering, et al., “Integrated
devices (e.g., optical isolators). 298 (2020). optical single-mode waveguide
4. H. Schröder, et al., “Planar glass structures in thin glass for flip-
Summary waveguides for high-performance chip PIC assembly and f iber
B e c a u s e o f i t s h i g h o p t i c a l electrical-optical circuit boards coupling,” 2020 IEEE 70th Elec.
transparency, ther mo-mechanical ( E O C B) - t h e g l a s s - l a y e r- Comp. and Tech. Conf. (ECTC),
compatibility to optics and optical concept,“ 53rd Elec. Comp. and 2020, pp. 148-155.
f ib e r s , a nd exc el le nt d iele c t r ic Tech. Conf., Proc., IEEE, 1053– 11. C. Si mon, et al., “Q u a nt u m
properties for high-frequency electric 1059 (2003). memories,” Eur. Phys. J. D 58,
guidance, glass has already proven 5. L. Brusberg, H. Schröder, “Glass- 1–22 (2010).
t o b e a valu able pa ck ag i ng a nd based interposer and board-level 12. P. Lodahl, et al., “Chiral quantum
interconnection platform for classical packaging,” Chip Scale Review, optics,” Nature, vol. 541, no. 7638,
data communication. Experiences July/Aug (2015). pp. 473–480. (2017).
gathered with glassy EOCBs are being 6. G . B ö t t g e r, S . S e i f e r t , H .
extended at Fraunhofer IZM into S c h rö de r , “ G l a s s - b a se d
quantum domain by increasing the manufacturing and prototyping
Biographies
Wojciech Lewoczko-Adamczyk is a Research Fellow at Fraunhofer Institute for Reliability and
Microintegration (IZM), Berlin, Germany. He studied Physics at the Jagiellonian U. of Cracow, Poland,
and received a Doctoral degree from Humboldt U. in Berlin. After his post-doctoral fellowship at the U.
of Amsterdam, he held a research position at the Ferdinand-Braun-Institute, Berlin, Germany. He joined
Fraunhofer IZM in 2016 as a scientist focused on optical interconnections and photonic packaging. Email
Wojciech.Lewoczko-Adamczyk@izm.fraunhofer.de
Henning Schröder is Group Manager of the Optical Interconnection Technologies Group (Dept. System Integration &
Interconnection Technologies), at Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin. He received his MSc
in Applied Physics from the U. of Magdeburg, Germany, and his PhD at the Technical U. of Berlin. His main fields are R&D
of optical interconnection technologies for printed circuit boards and photonic modules. He holds many patents in photonic
packaging technologies and is a member of the German Physical Society, the German Society of Applied Optics, and the
European Optical Society.
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