Page 49 - ChipScale_Mar-Apr_2021-digital

reliability for large-die flip-chip
lead-free BGA package in power
cycling and thermal cycling tests,”
61st ECTC 2011, pp. 921-926.
6. L. Garner, C. Zhang, K. S. Beh,
K. Helms, Y. L. Tan, “Effect of
compression loads on the solder
joint reliability of flip-chip BGA
packages,” 54th ECTC 2004, pp.
692-698.
7. T- C. C h iu , D. E d wa rd s , M.
Ahmad, “Ball grid array solder
joint reliability under system-level
compressive load,” IEEE Trans. on
Device and Materials Reliability,
vol. 10, no. 3, Sep. 2010, pp. 324-
337.
8. P. K. Bhatti, M. Pei, X. Fan,
“Reliability analysis of SnPb and
SnAgCu solder joints in FC-BGA
packages with thermal enabling
preload,” 56th ECTC 2006, pp.
601-606.
9. X. Fan, M. Pei, P.K. Bhat ti,
“Effect of finite element modeling
techniques on solder joint fatigue
life prediction of flip-chip BGA
packages,” 56th ECTC 2006, pp.
972-980.
10. G. Gust afsson, I. Guven, V.
Kradinov, E. Madenci, “Finite
e l e m e n t m o d e l i n g o f B G A
packages for life prediction,” 50th
ECTC 2000, pp. 1059-1063.
11. L. F. Coffin, “A study of the
effects of cyclic thermal stresses
on ductile metal,” ASME Trans.,
Vol. 76, pp. 931-950, 1954.
12. JEDEC STANDARD Temperature RoHS
Cycling JESD22-A104E. P
13. I PC - 9 7 01 A , “ P e r f o r m a nc e
test methods and qualification
requirements for surface mount
solder attachments,” IPC, 2006.

Biographies
Manish Nayini is Senior Engineer, Packaging Engineering at Marvell Semiconductor, USA, Hopewell
Junction, NY. He works on thermomechanical simulations at the package- and board-level. He has been with
Marvell for the past year; prior to that, he worked for 3 years at Globalfoundries in the Advanced Packaging
Development Group. He has a Masters in Mechanical Engineering from Arizona State U., and a Bachelors in
Mechanical Engineering from BITS Pilani, Goa, India. Email mnayini@marvell.com

Timothy Horn is a Packaging Reliability Engineer at GLOBALFOUNDRIES, USA. After completing his
BS in Microelectronic Engineering at RIT in 2015, he pursued a passion for material characterization through his work as a
reliability engineer at GLOBALFOUNDRIES, USA and by working on his MS in Materials Science at UVM (expected in May,
2021) as a part time endeavor.

47
Chip Scale Review March • April • 2021 [ChipScaleReview.com] 47