Page 44 - ChipScale_Mar-Apr_2021-digital

With low inductance being a priority, different wavelengths for a clear DAF safety being a priority, LIDAR is being
especially for ToF applications in the solution adhesive that offers over 93% developed as a major component for
detectable range, high-power short- transparency in the infrared spectrum ADAS. We are positioned to provide
pulse is a requirement and a transition (770-1000nm wavelength). Structure package solutions for each segment
from long-lead, through-hole laser B (Figure 7) utilizes a clear DAF to of ADAS, including cameras, radar
packages (with high inductance) to attach the glass while structure A uses and LIDAR. Utilizing geographically
surface mount packages with an array of an ultraviolet (UV) curable epoxy to dispersed factories, ser vices are
laser diodes will be key. Beam quality attach the glass to create an air gap. A strategically implemented to customers
is another requirement that will depend UV-curable epoxy aids in mitigating worldwide in automotive, industrial
heavily on reducing package electrical pressure buildup within the cavity that and consumer applications. While
losses. To find the right path forward, would be increased with a thermal cure focused on delivering products from
the successful technology achievements epoxy. By utilizing similar technologies, the existing portfolio of packages
in optical fingerprint sensors and multiple sensors can be integrated into in the photo detector portion of the
MEMS sensors can be leveraged to one package and continue to evolve LIDAR block, innovative solutions in
offer improved packaging solutions for into the future. As shown in Figure the form of system-in-package (emitter
LIDAR customers. 7, structures C, D and E show three and receiver) that further spearhead
In addition, molded-cavity fingerprint different solutions for combo-sensors integration in a single package/module
sensor packaging (Figure 7, structures including a ceramic substrate with a will be developed as LIDAR continues
A and B) has been successfully qualified stacked die solution on top (structure to evolve towards cost- effective
for automotive applications under the C). Because of the high average power solutions. Going forward, we will rely
Automotive Electronics Council’s of approximately 12-25W for long range on our strong technology know-how
AEC-Q100 Grade 2 specifications. LIDAR, a ceramic substrate such as and customer partnerships to deliver
While automotive grade packages need the top solution might be required. The advanced solutions to these challenges.
to undergo more stringent requirements top solution is also optimal for many
than consumer fingerprint sensors, we ToF applications where a large amount References
have been able to use a standardized of heat is produced because it poses 1. “Road Traffic Injuries,” World
process and qualify them specifically the best thermal performance and least Health Organization, https://www.
for automotive complementary metal- warpage. Structures D and E both utilize who.int/news-room/fact-sheets/
oxide-semiconductor (CMOS) image wire-bond interconnects with a laminate detail/road-traffic-injuries
sensors, ToF and LIDAR applications. substrate. The difference is one utilizes 2. “Traffic Safety Facts Annual Report
The current molded-cavity structures a molded solution (E), while the other Tables,” NHTSA, https://cdan.nhtsa.
can be modified to meet customers’ a liquid crystal polymer (LCP) lid (D). gov/tsftables/tsfar.htm
needs including, flip-chip/copper pillar Both solutions are optimal for lower 3. Y. Li, J. Ibanez-Guzman, et al.,
bonds instead of wire bond, LGA power applications. An example of this “Lidar for autonomous driving: the
instead of BGA and varying glass attach might be short-range LIDARs where the principles, challenges, and trends
epoxies for different applications. typical power output may be <6W. These for automotive Lidar and perception
As an example of the discussion packages can be used to bring a lower systems,” IEEE Signal Processing
above, consider that a ToF sensor within cost, high-quality LIDAR solution to the Magazine, Vol. 37, Issue: 4, July 2020.
the cabin of a vehicle for a gesture market through strategic partnerships
control application might not need an with the supply chain and customers.
extremely clear and precise image, so
by eliminating the need for an air gap Summary
and attaching the glass using a clear Driven by environmental, economic
die attach film (DAF), pressure buildup a n d s o c i a l f a c t o r s , d e m a n d fo r
within the package might be reduced. soph ist icat ed automot ive safet y
Figure 8 shows the transparency at solutions will increase. Affordable

Biographies
Ajay Sattu is Sr. Manager, Automotive Product Marketing at Amkor Technology, Inc., Tempe, AZ. He
is focused on automotive electrification, ADAS and infotainment product marketing and strategy. Prior to
joining Amkor, he worked for Infineon, managing technology and product development of wide-bandgap
semiconductors. He has published several peer-reviewed articles and presented at industry conferences.
He holds a PhD in Electrical Engineering from U. of South Carolina and an MBA from UCLA Anderson.
Email ajay.Sattu@amkor.com

Burt Barber is a MEMS and Sensors Consultant at Amkor Technology, Inc., Tempe, AZ. With more than 20 years’ experience
in the global semiconductor supply chain, he has served in various key marketing and business/product development positions
at MEMC/Sun/Edison, Texas Instruments, Alcatel, Xilinx and Hitachi Semiconductor. He holds a BS in Electrical Engineering
from Santa Clara U. and an MBA from U. of San Francisco.

42 Chip Scale Review March • April • 2021 [ChipScaleReview.com]
42