Page 42 - ChipScale_Mar-Apr_2021-digital

automotive. One example of the cost
breakdown of a mechanical LIDAR is
shown in Figure 5. According to IHS
Markit, the cost of a mechanical LIDAR
system with 64-channel scanning could
reach a price point below $800 by 2025.
If achieved, such a price point for a
LIDAR module might be affordable
for OEMs focusing on mobility as a
service (MaaS) with ADAS capabilities
higher than Level 4. For personal use
vehicles, cheaper LIDAR solutions may
be preferred. Figure 7: Amkor’s packaging solutions.
Being an outsourced semiconductor
assembly and test (OSAT) supplier, quality and performance for low- applications such as infotainment, it
we bring knowledge and economies of cost solutions. To further understand begs the question of how integrated a
scale to offer cost-effective solutions. the levers to reduce cost and improve LIDAR package solution can be and
For example, successful cost reduction functionality, one needs to understand the possibility of integration trends.
has been demonstrated by using a the building blocks for a LIDAR system For example, an integrated APD and
standardized process f low through (Figure 6). The cur rent building a trans-impedance amplifier (TIA) or
our MEMS sensors platform. Cavity blocks for a LIDAR system contain an an integrated SPAD with an ASIC can
ball grid array (BGA)/land grid array emitter that illuminates the scene, a be packaged either in a side-by-side
(LGA) and molded cavity BGA/LGA detector to capture the reflected light, or as a chip-on-wafer (CoW) solution.
standardized packages can target many an application-specific integrated circuit Further, a digital signal processing
market categories such as biometric (ASIC) to process the signal, and a (DSP) die can be co-integrated through
authentication, automotive, human processing unit to analyze the data. a possible hybrid solution on a printed
interface, environmental and healthcare/ While most of the solutions today are circuit board (PCB) or monolithic
fitness. Standardization also offers in discrete form, integration of multiple system on chip (SoC) detector solution.
faster time to market. Though most of chips in a single package or multiple Both have their own advantages and
the current laser diode and detector packaged parts on a single substrate disadvantages. For example, monolithic
packaging uses high-cost ceramic could be possible future trends. solutions offer low NIR sensitivity and
subst rates, leveraging suppliers’ Wit h syst e m-i n-pa ck age (Si P) better speed of detection, while hybrid
continued development of laminates, modules being so successful in other solutions offer higher NIR sensitivity
lid and mold compounds can ensure automotive applications, as well as and have a better aper t ure ratio.

Figure 8: Clear die attach film transparency spectrum. (SOURCES: Loctite, Henkel Adhesives

40
40 Chip Scale Review March • April • 2021 [ChipScaleReview.com]