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Laser Assisted Bonding

SMD LED

• SMD placement • Mini & Micro LED assembly
on ultra-thin flex for repair and mass transfer

Pin bonding VCSEL

• Single & multipin attach • diode assembly in between
on various substrate cooling block
material

2D - 2.5D Packaging 3D Packaging

• Chip on wafer, • In-situ die placement & reflow
chip on board, • Lowest thermal & mechanical
chip on chip, stress
package on package • High chip stack uniformity

3.5D Multilayer Die Stacking Selective Chip Rework

• Horizontal & vertical chip • Selective removal of bad die
assembly • In-situ replacement & reflow
• No requirement for TSV • Cost saving for high density
structures fan-out packaging
• Simplification of complex
package design

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