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its robustness in detection, range resolution
and simultaneous multiple-depth detection
under severe environmental conditions.
Fan-out packaging is already established
in radar and 77GHz performance is proven
to be better than other packaging platforms
such as flip-chip ball grid array (FCBGA).
This improvement is because of the routing
of redistribution layers (RDLs) from
thin-flim processing in FOWLP, thereby
resulting in very small layer dimensions
and tolerances. Consequently, the fine line/
space from RDL processing enables low-
loss wiring and superior RF performance
[2,4].

Production volume of fan-out
packaging
In terms of production volume, both
FOWLP and FOPLP are growing, though
FOPLP will grow significantly faster
from 2021 and beyond (Figure 3). We
do note that the COVID-19 pandemic
(Coronavirus) has caused a contraction of
Figure 1: Weibull plot for WLCSP vs. M-Series™. SOURCE: DECA
the overall economic activity, negatively
of Things (IoT) devices is boosting the validated by fan-out packaging from many impacting semiconductor development
demands for HPC systems and data fabless players like NVIDIA, Mediatek, and production as seen in 2019 and 2020
centers. Higher functionality coupled with Nephos and HiSilicon. [2,5]. FOWLP revenue will continue
smaller package sizes are main drivers Lastly, for radar at 77GHz, advanced to experience some decline in 2020,
for fan-out system in package (SiP). The driver assistance systems (ADAS) are reflecting the COVID-19 impact for
industry is relying more on heterogeneous paving the way for full autonomy in the mobile and consumer applications.
solutions to integrate dies with shorter automotive industry [2,4]. A 77GHz Data-driven end systems, however,
and denser interconnections [2]. Based on automotive radar system offers key continue to grow in delivering more
early stage testing, high-bandwidth and advantages over a 24GHz radar and light data functionalities paving the way
high-speed SERDES signal is positively detection and ranging (LiDAR) because of to 5G adoption. FOWLP revenue for

Figure 2: Fan-out packaging drivers. SOURCE: YDR20078 Fan-out Packaging 2020 Yole Report, Yole Développement

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