Wilmington, MA -(BUSINESS WIRE)-September 4, 2024 -Onto Innovation Inc. (NYSE: ONTO) announced the opening of the company’s Packaging Applications Center of Excellence (PACE), a first-of-its-kind…
ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI Latest agreement aims to advance thermocompression and hybrid bonding methods for chiplet packages
Singapore and Armonk, New York, July 24, 2024 — ASMPT and IBM today announced a renewed agreement to extend their collaboration on the joint development…
Resonac Announces New US-JOINT Consortium; Ten Partners to Collaborate on Next-Generation Semiconductor Packaging in Silicon Valley
Resonac announces new US-JOINT consortium; ten partners to collaborate on Next-generation semiconductor packaging in Silicon Valley The consortium will help to further advance technology in…
Siemens partners with Microsoft to deliver AI-enhanced solutions for resilient product lifecycle management with Azure
In response to growing customer demand, the Siemens Xcelerator as a Service portfolio will become available on Microsoft Azure, beginning with Siemens’ Teamcenter X software…
Amkor Technology and GlobalFoundries cut ribbon on strategic cooperation in Portugal
Partnership to strengthen European automotive supply chain and expand services for global customers Tempe, AZ, USA – January 16, 2024 — Amkor Technology, Inc. (Nasdaq:…