Businesses and consumers are adopting artificial intelligence (AI) at a rapid pace, placing enormous new demands on computing and communications. Next-generation data centers supporting upcoming…
Heterogeneous chiplet integration to make megachips
By Rabindra N. Das, Jason Plant, Alex Wynn, Matthew Ricci, Ryan Johnson, Matthew Stamplis, et al. [MIT Lincoln Laboratory] Chip Scale Review January • February…
Large-size multi-layered fan-out RDL multi-chip module packaging
Large-size multi-layered fan-out RDL multi-chip module packaging By Nicholas Kao, Jay Li, Jackson Li, Yu-Po Wang[Siliconware Precision Industries Co., Ltd] This article was published in…
Sustaining Moore’s Law with graphene
Since the invention of metaloxide-semiconductor(MOS) integrated circuits in the early 1960s, the speed, capacity, and complexity of the chips have increased dramatically, roughly following Moore’s…