The 27th Electronics Packaging Technology Conference (EPTC2025) will take place from December 2, – December 5, 2025 in Singapore. The Electronics Packaging Technology Conference (EPTC)…
Teradyne Unveils Magnum 7H – The Next-Generation Memory Tester for High Bandwidth Memory Devices
NORTH READING, Mass.–(BUSINESS WIRE)– Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, is proud to announce the launch of…
IMAPS Symposium 2025 | co-located with Semiconductor Thermal Management | September 29 – October 2, 2025
San Diego, CA USA – September 29 – October 2, 2025 |The 58th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and…
Marvell Develops Industry’s First 2nm Custom SRAM for Next-Generation AI Infrastructure Silicon
Marvell Develops Industry’s First 2nm Custom SRAM for Next-Generation AI Infrastructure Silicon Industry’s highest bandwidth per sq mm with up to 6 gigabits of high-speed…
Applied Materials and CEA-Leti Expand Joint Lab To Drive Innovation in Specialty Chips
Applied Materials and CEA-Leti Expand Joint Lab To Drive Innovation in Specialty Chips Based at CEA-Leti, collaboration focuses on materials engineering solutions To enable more…
Teradyne To Acquire Quantifi Photonics
March 10, 2025 | Teradyne to acquire Quantifi Photonics to deliver photonic IC testing to the high-performance Compute market NORTH READING, Mass.–(BUSINESS WIRE)– Teradyne, Inc.…
ficonTEC releases innovative wafer-level test cell to complement existing ATE
ficonTEC reveals an innovative 300 mm double-sided electro-optical wafer tester compatible with existing ATE and targeted at AI-driven silicon photonics March, 2025 | ficonTEC Service…
Launch of UC5000 Semiconductor Packaging Equipment Compatible with Large Glass Panels ~ High-accuracy packaging in panel level packaging
TOKYO / MARCH 27, 2025 — Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) has developed the…
Canon honored with Excellent Production Support In Advanced Packaging at TSMC 2024 Excellent Performance Awards
TOKYO, January 10, 2025—Canon Inc. announced today that the company has been honored with a 2024 Excellent Performance Award, presented by leading global semiconductor foundry…
Smiths Interconnect’s DaVinci 112 High-Speed Test Socket Wins Best Test Measurement Award at the 2024 Global Electronics Achievement Awards
Smiths Interconnect’s DaVinci 112 High-Speed Test Socket Wins Best Test Measurement Award at the 2024 Global Electronics Achievement Awards Shenzhen, China – November 5, 2024…