The 76th Electronics Packaging Technology Conference EPTC 2026. Bring your networking to the next level at ECTC! With technical sessions, panels, interactive presentations, a high…
IMAPS Device Packaging Conference 2026 – March 2-5 in Phoenix, Arizona
IMAPS Device Packaging Conference 2026 | March 2-5 in Phoenix, Arizona The Most Comprehensive technical program and exhibition for microelectronics and Advanced Packaging 🎤 Overcoming…
MRSI Mycronic announces advanced high-speed 1µm die bonder MRSI-LEAP for ultra-high-volume manufacturing of AI optical module applications
MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed for ultra-high-volume manufacturing of optical…
FAMES pilot line inaugurated after delivering first validated technical results
FAMES pilot line inaugurated after delivering first validated technical results New cleanroom Is a world-class facility that will host state-of-the-art 300mm semiconductor equipment Grenoble, France…
ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation
Sunnyvale, CA USA, Nov 04, 2025 – Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today…
Deca and Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
The collaboration provides customers with a modular, memory-centric foundation for advanced multi-die architectures Chandler, AZ. and San Jose, CA., Sept. 10, 2025 (GLOBE NEWSWIRE) — As…
Siemens collaborates with TSMC to accelerate 3D IC and AI-driven circuit and systems design
Plano, Texas, USA – September 24, 2025 | Today at the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum, Siemens Digital Industries Software…
The Electronics Packaging Technology Conference EPTC 2025
The 27th Electronics Packaging Technology Conference (EPTC2025) will take place from December 2, – December 5, 2025 in Singapore. The Electronics Packaging Technology Conference (EPTC)…
Teradyne Unveils Magnum 7H – The Next-Generation Memory Tester for High Bandwidth Memory Devices
NORTH READING, Mass.–(BUSINESS WIRE)– Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, is proud to announce the launch of…
IMAPS Symposium 2025 | co-located with Semiconductor Thermal Management | September 29 – October 2, 2025
San Diego, CA USA – September 29 – October 2, 2025 |The 58th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and…