The collaboration provides customers with a modular, memory-centric foundation for advanced multi-die architectures Chandler, AZ. and San Jose, CA., Sept. 10, 2025 (GLOBE NEWSWIRE) — As…
Siemens collaborates with TSMC to accelerate 3D IC and AI-driven circuit and systems design
Plano, Texas, USA – September 24, 2025 | Today at the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum, Siemens Digital Industries Software…
The Electronics Packaging Technology Conference EPTC 2025
The 27th Electronics Packaging Technology Conference (EPTC2025) will take place from December 2, – December 5, 2025 in Singapore. The Electronics Packaging Technology Conference (EPTC)…
Teradyne Unveils Magnum 7H – The Next-Generation Memory Tester for High Bandwidth Memory Devices
NORTH READING, Mass.–(BUSINESS WIRE)– Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, is proud to announce the launch of…
IMAPS Symposium 2025 | co-located with Semiconductor Thermal Management | September 29 – October 2, 2025
San Diego, CA USA – September 29 – October 2, 2025 |The 58th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and…
Marvell Develops Industry’s First 2nm Custom SRAM for Next-Generation AI Infrastructure Silicon
Marvell Develops Industry’s First 2nm Custom SRAM for Next-Generation AI Infrastructure Silicon Industry’s highest bandwidth per sq mm with up to 6 gigabits of high-speed…
Applied Materials and CEA-Leti Expand Joint Lab To Drive Innovation in Specialty Chips
Applied Materials and CEA-Leti Expand Joint Lab To Drive Innovation in Specialty Chips Based at CEA-Leti, collaboration focuses on materials engineering solutions To enable more…
Teradyne To Acquire Quantifi Photonics
March 10, 2025 | Teradyne to acquire Quantifi Photonics to deliver photonic IC testing to the high-performance Compute market NORTH READING, Mass.–(BUSINESS WIRE)– Teradyne, Inc.…
ficonTEC releases innovative wafer-level test cell to complement existing ATE
ficonTEC reveals an innovative 300 mm double-sided electro-optical wafer tester compatible with existing ATE and targeted at AI-driven silicon photonics March, 2025 | ficonTEC Service…
Launch of UC5000 Semiconductor Packaging Equipment Compatible with Large Glass Panels ~ High-accuracy packaging in panel level packaging
TOKYO / MARCH 27, 2025 — Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) has developed the…