IEEE European Test Symposium (ETS) is Europe’s premier forum dedicated to presenting and discussing scientific results, emerging ideas, hot topics and new trends, as well…
Teradyne To Acquire Quantifi Photonics
March 10, 2025 | Teradyne to acquire Quantifi Photonics to deliver photonic IC testing to the high-performance Compute market NORTH READING, Mass.–(BUSINESS WIRE)– Teradyne, Inc.…
ficonTEC releases innovative wafer-level test cell to complement existing ATE
ficonTEC reveals an innovative 300 mm double-sided electro-optical wafer tester compatible with existing ATE and targeted at AI-driven silicon photonics March, 2025 | ficonTEC Service…
Launch of UC5000 Semiconductor Packaging Equipment Compatible with Large Glass Panels ~ High-accuracy packaging in panel level packaging
TOKYO / MARCH 27, 2025 — Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) has developed the…
CHIPcon 2025 | JULY 7-10, 2025 | SAN JOSE MARRIOTT | San Jose, California
The leading event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology … Addressing the challenges and opportunities for enabling broader adoption of chiplet architectures The program…
Canon honored with Excellent Production Support In Advanced Packaging at TSMC 2024 Excellent Performance Awards
TOKYO, January 10, 2025—Canon Inc. announced today that the company has been honored with a 2024 Excellent Performance Award, presented by leading global semiconductor foundry…
ECTC 2025 – The Gaylord Texan Resort & Convention Center – May 27-30 2025
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology…
Smiths Interconnect’s DaVinci 112 High-Speed Test Socket Wins Best Test Measurement Award at the 2024 Global Electronics Achievement Awards
Smiths Interconnect’s DaVinci 112 High-Speed Test Socket Wins Best Test Measurement Award at the 2024 Global Electronics Achievement Awards Shenzhen, China – November 5, 2024…
ASU and Deca Technologies selected to lead $100M SHIELD USA project to strengthen U.S. semiconductor packaging capabilities
ASU and Deca Technologies selected to lead $100M SHIELD USA project to strengthen U.S. semiconductor packaging capabilities TEMPE, AZ-USA | November 21, 2024 – The…
Semiconductor scaling with high-productivity multicolumn electron-beam lithography
Businesses and consumers are adopting artificial intelligence (AI) at a rapid pace, placing enormous new demands on computing and communications. Next-generation data centers supporting upcoming…