The 26th Electronics Packaging Technology Conference will be held December 3rd – 6th 2024. The conference will be at the Grand Copthorne Waterfront Hotel, Singapore…
Semiconductor scaling with high-productivity multicolumn electron-beam lithography
Businesses and consumers are adopting artificial intelligence (AI) at a rapid pace, placing enormous new demands on computing and communications. Next-generation data centers supporting upcoming…
Onto Innovation Announces Opening of Packaging Applications Center of Excellence
Wilmington, MA -(BUSINESS WIRE)-September 4, 2024 -Onto Innovation Inc. (NYSE: ONTO) announced the opening of the company’s Packaging Applications Center of Excellence (PACE), a first-of-its-kind…
MRSI Systems: The High-Performance and FlexibleMRSI-A-L for Optical Assembly
August 5, 2024 – Tewksbury, MA, USA: MRSI Systems The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We…
ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI Latest agreement aims to advance thermocompression and hybrid bonding methods for chiplet packages
Singapore and Armonk, New York, July 24, 2024 — ASMPT and IBM today announced a renewed agreement to extend their collaboration on the joint development…
Resonac Announces New US-JOINT Consortium; Ten Partners to Collaborate on Next-Generation Semiconductor Packaging in Silicon Valley
Resonac announces new US-JOINT consortium; ten partners to collaborate on Next-generation semiconductor packaging in Silicon Valley The consortium will help to further advance technology in…
Siemens partners with Microsoft to deliver AI-enhanced solutions for resilient product lifecycle management with Azure
In response to growing customer demand, the Siemens Xcelerator as a Service portfolio will become available on Microsoft Azure, beginning with Siemens’ Teamcenter X software…
EV Group Doubles Throughput of Innovative Semiconductor Layer Transfer Technology with New EVG®880 LayerRelease™ System
Dedicated HVM equipment platform boosts productivity and lowers cost-of-ownership of novel infrared laser release technology through silicon carrier wafers for 3D integration applications ST. FLORIAN,…
ASE introduces powerSiP™ for transformative power delivery that increases power efficiencies by 50% in AI and data center applications
SUNNYVALE, Calif., May 29, 2024 – Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced…
Toray develops hybrid bonding insulating resin that helps enhance yields and reliability in high-density semiconductor packaging
Tokyo, Japan, March 15, 2024 – Toray Industries, Inc., announced today that it has developed an insulating resin material for hybrid bonding (micro bonding). The…