TOKYO, January 10, 2025—Canon Inc. announced today that the company has been honored with a 2024 Excellent Performance Award, presented by leading global semiconductor foundry…
ECTC 2025 – The Gaylord Texan Resort & Convention Center – May 27-30 2025
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology…
IMAPS Device Packaging Conference and Advanced Packaging for Medical Microelectronics Workshop – March 3-7 – Phoenix, AZ USA
IMAPS Device Packaging Conference and Advanced Packaging for Medical Microelectronics Workshop to Co-locate Both events to take place March 3-7, 2025 in Phoenix, Arizona Device…
TestConX 2025 – March 2-5 – Mesa, AZ USA
TestConX is the preeminent event for test consumables, test cell integration, and test operations. The Conference & Expo will be held March 2-5 at: DoubleTree…
Smiths Interconnect’s DaVinci 112 High-Speed Test Socket Wins Best Test Measurement Award at the 2024 Global Electronics Achievement Awards
Smiths Interconnect’s DaVinci 112 High-Speed Test Socket Wins Best Test Measurement Award at the 2024 Global Electronics Achievement Awards Shenzhen, China – November 5, 2024…
ASU and Deca Technologies selected to lead $100M SHIELD USA project to strengthen U.S. semiconductor packaging capabilities
ASU and Deca Technologies selected to lead $100M SHIELD USA project to strengthen U.S. semiconductor packaging capabilities TEMPE, AZ-USA | November 21, 2024 – The…
Semiconductor scaling with high-productivity multicolumn electron-beam lithography
Businesses and consumers are adopting artificial intelligence (AI) at a rapid pace, placing enormous new demands on computing and communications. Next-generation data centers supporting upcoming…
Onto Innovation Announces Opening of Packaging Applications Center of Excellence
Wilmington, MA -(BUSINESS WIRE)-September 4, 2024 -Onto Innovation Inc. (NYSE: ONTO) announced the opening of the company’s Packaging Applications Center of Excellence (PACE), a first-of-its-kind…
ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI Latest agreement aims to advance thermocompression and hybrid bonding methods for chiplet packages
Singapore and Armonk, New York, July 24, 2024 — ASMPT and IBM today announced a renewed agreement to extend their collaboration on the joint development…
Resonac Announces New US-JOINT Consortium; Ten Partners to Collaborate on Next-Generation Semiconductor Packaging in Silicon Valley
Resonac announces new US-JOINT consortium; ten partners to collaborate on Next-generation semiconductor packaging in Silicon Valley The consortium will help to further advance technology in…