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The Future of Semiconductor Packaging

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Author: CSR Editor

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The Electronics Packaging Technology Conference EPTC 2025

The 27th Electronics Packaging Technology Conference (EPTC2025) will take place from December 2, – December 5, 2025 in Singapore. The Electronics Packaging Technology Conference (EPTC)…

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Teradyne Unveils Magnum 7H – The Next-Generation Memory Tester for High Bandwidth Memory Devices

NORTH READING, Mass.–(BUSINESS WIRE)– Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, is proud to announce the launch of…

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IMAPS Symposium 2025 | co-located with Semiconductor Thermal Management | September 29 – October 2, 2025

San Diego, CA USA – September 29 – October 2, 2025 |The 58th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and…

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Marvell Develops Industry’s First 2nm Custom SRAM for Next-Generation AI Infrastructure Silicon

Marvell Develops Industry’s First 2nm Custom SRAM for Next-Generation AI Infrastructure Silicon Industry’s highest bandwidth per sq mm with up to 6 gigabits of high-speed…

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Applied Materials and CEA-Leti Expand Joint Lab To Drive Innovation in Specialty Chips

Applied Materials and CEA-Leti Expand Joint Lab To Drive Innovation in Specialty Chips Based at CEA-Leti, collaboration focuses on materials engineering solutions To enable more…

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Teradyne To Acquire Quantifi Photonics

March 10, 2025 | Teradyne to acquire Quantifi Photonics to deliver photonic IC testing to the high-performance Compute market NORTH READING, Mass.–(BUSINESS WIRE)– Teradyne, Inc.…

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ficonTEC releases innovative wafer-level test cell to complement existing ATE

ficonTEC reveals an innovative 300 mm double-sided electro-optical wafer tester compatible with existing ATE and targeted at AI-driven silicon photonics March, 2025 | ficonTEC Service…

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Launch of UC5000 Semiconductor Packaging Equipment Compatible with Large Glass Panels ~ High-accuracy packaging in panel level packaging

TOKYO / MARCH 27, 2025 — Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) has developed the…

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Canon honored with Excellent Production Support In Advanced Packaging at TSMC 2024 Excellent Performance Awards

TOKYO, January 10, 2025—Canon Inc. announced today that the company has been honored with a 2024 Excellent Performance Award, presented by leading global semiconductor foundry…

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Smiths Interconnect’s DaVinci 112 High-Speed Test Socket Wins Best Test Measurement Award at the 2024 Global Electronics Achievement Awards

Smiths Interconnect’s DaVinci 112 High-Speed Test Socket Wins Best Test Measurement Award at the 2024 Global Electronics Achievement Awards Shenzhen,  China – November 5, 2024…

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