On The Flip Side
Industry Interviews by Chip Scale Review
ON THE FLIP SIDE with Debra Vogler is Chip Scale Review’s new segment, bringing insightful interviews with semiconductor industry experts to chipscalereview.com.
In the first episode, Dr. Ayad Ghannam, CEO and CTO of 3DIS Technologies, talks about 3D integration and 3D packaging solutions based on innovative 3D interconnection technologies.
By loading the video, you agree to YouTube’s privacy policy.
Learn more