Original, well-written articles are the lifeblood of Chip Scale Review magazine. We welcome your contributions and we’re eager to help you in any way that we can. Ultimately, the publication of contributed articles represents a team effort by our contributors and the editors and production staff of Chip Scale Review.

By following the guidelines below, you will help us expedite the processing of your article through acceptance, editing, production and publication. While you may submit a completed article, in almost every case you will save time and trouble if you first submit an abstract of 200-300 words before beginning. Obviously, we expect the finished article to closely follow the accepted abstract with respect to subject and tone.

Send to: editor@chipscalereview.com

Criteria for acceptance

• Be original to Chip Scale Review. We do not accept articles that have been printed in another publication. Papers that have been presented at conferences and published in proceedings should be rewritten in Chip Scale Review’s magazine style, and ideally, updated or modified to include new information whenever possible. Furthermore, a reference as to where and when the paper was previously presented should be included (i.e., an attribution). Contact the organization involved to see if they have any required credit line that must be used. Usually, there is a standard credit format that they will want to use.

• Advance the state of knowledge of chip-scale- and wafer-level packaging (WLP), and backend process, through-silicon vias (TSVs), interconnects, advanced IC assembly/packaging, and/or wafer/device test. This includes the system-in-package (SiP), system-on-package (SoP), package-on-package (PoP), chip-on-wafer (CoW), or other multi-chip 2D/3D package variants used today— each with some pragmatic size, manufacturing and cost advantages. Chip Scale Review covers the high-density interconnect (HDI) organic and inorganic substrates and interposers that are essential for multi-chip package implementations and embedding active and passive components in substrates. We are also interested in articles that address integrating ICs with other nanotechnology, MEMS, RF/wireless and optoelectronic/photonic devices.

• Be free of commercialism and marketing hype.

• Be well written with solid technical content that will be understandable by the majority of our readers.

• Never submit the same article to more than one publication at the same time!