Sunnyvale, CA USA, Nov 04, 2025 – Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today…
Deca and Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
The collaboration provides customers with a modular, memory-centric foundation for advanced multi-die architectures Chandler, AZ. and San Jose, CA., Sept. 10, 2025 (GLOBE NEWSWIRE) — As…
Siemens collaborates with TSMC to accelerate 3D IC and AI-driven circuit and systems design
Plano, Texas, USA – September 24, 2025 | Today at the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum, Siemens Digital Industries Software…
Teradyne Unveils Magnum 7H – The Next-Generation Memory Tester for High Bandwidth Memory Devices
NORTH READING, Mass.–(BUSINESS WIRE)– Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, is proud to announce the launch of…
Marvell Develops Industry’s First 2nm Custom SRAM for Next-Generation AI Infrastructure Silicon
Marvell Develops Industry’s First 2nm Custom SRAM for Next-Generation AI Infrastructure Silicon Industry’s highest bandwidth per sq mm with up to 6 gigabits of high-speed…
Applied Materials and CEA-Leti Expand Joint Lab To Drive Innovation in Specialty Chips
Applied Materials and CEA-Leti Expand Joint Lab To Drive Innovation in Specialty Chips Based at CEA-Leti, collaboration focuses on materials engineering solutions To enable more…
Teradyne To Acquire Quantifi Photonics
March 10, 2025 | Teradyne to acquire Quantifi Photonics to deliver photonic IC testing to the high-performance Compute market NORTH READING, Mass.–(BUSINESS WIRE)– Teradyne, Inc.…
ficonTEC releases innovative wafer-level test cell to complement existing ATE
ficonTEC reveals an innovative 300 mm double-sided electro-optical wafer tester compatible with existing ATE and targeted at AI-driven silicon photonics March, 2025 | ficonTEC Service…
Launch of UC5000 Semiconductor Packaging Equipment Compatible with Large Glass Panels ~ High-accuracy packaging in panel level packaging
TOKYO / MARCH 27, 2025 — Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) has developed the…
Canon honored with Excellent Production Support In Advanced Packaging at TSMC 2024 Excellent Performance Awards
TOKYO, January 10, 2025—Canon Inc. announced today that the company has been honored with a 2024 Excellent Performance Award, presented by leading global semiconductor foundry…