Marvell Develops Industry’s First 2nm Custom SRAM for Next-Generation AI Infrastructure Silicon Industry’s highest bandwidth per sq mm with up to 6 gigabits of high-speed…
Applied Materials and CEA-Leti Expand Joint Lab To Drive Innovation in Specialty Chips
Applied Materials and CEA-Leti Expand Joint Lab To Drive Innovation in Specialty Chips Based at CEA-Leti, collaboration focuses on materials engineering solutions To enable more…
Teradyne To Acquire Quantifi Photonics
March 10, 2025 | Teradyne to acquire Quantifi Photonics to deliver photonic IC testing to the high-performance Compute market NORTH READING, Mass.–(BUSINESS WIRE)– Teradyne, Inc.…
ficonTEC releases innovative wafer-level test cell to complement existing ATE
ficonTEC reveals an innovative 300 mm double-sided electro-optical wafer tester compatible with existing ATE and targeted at AI-driven silicon photonics March, 2025 | ficonTEC Service…
Launch of UC5000 Semiconductor Packaging Equipment Compatible with Large Glass Panels ~ High-accuracy packaging in panel level packaging
TOKYO / MARCH 27, 2025 — Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) has developed the…
CHIPcon 2025 | JULY 7-10, 2025 | SAN JOSE MARRIOTT | San Jose, California
The leading event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology … Addressing the challenges and opportunities for enabling broader adoption of chiplet architectures The program…
Canon honored with Excellent Production Support In Advanced Packaging at TSMC 2024 Excellent Performance Awards
TOKYO, January 10, 2025—Canon Inc. announced today that the company has been honored with a 2024 Excellent Performance Award, presented by leading global semiconductor foundry…