Tokyo, Japan, March 15, 2024 – Toray Industries, Inc., announced today that it has developed an insulating resin material for hybrid bonding (micro bonding). The…
Heterogeneous chiplet integration to make megachips
By Rabindra N. Das, Jason Plant, Alex Wynn, Matthew Ricci, Ryan Johnson, Matthew Stamplis, et al. [MIT Lincoln Laboratory] Chip Scale Review January • February…
Amkor Technology and GlobalFoundries cut ribbon on strategic cooperation in Portugal
Partnership to strengthen European automotive supply chain and expand services for global customers Tempe, AZ, USA – January 16, 2024 — Amkor Technology, Inc. (Nasdaq:…
Gel-Pak announces new Gel-Probe product line
Hayward, CA, USA – Gel-Pak, a Delphon company and a global leader in elastomer-based materials and protective carriers for the semiconductor, medical, and electronics industries,…