In response to growing customer demand, the Siemens Xcelerator as a Service portfolio will become available on Microsoft Azure, beginning with Siemens’ Teamcenter X software…
EV Group Doubles Throughput of Innovative Semiconductor Layer Transfer Technology with New EVG®880 LayerRelease™ System
Dedicated HVM equipment platform boosts productivity and lowers cost-of-ownership of novel infrared laser release technology through silicon carrier wafers for 3D integration applications ST. FLORIAN,…
ASE introduces powerSiP™ for transformative power delivery that increases power efficiencies by 50% in AI and data center applications
SUNNYVALE, Calif., May 29, 2024 – Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced…