Tokyo, Japan, March 15, 2024 – Toray Industries, Inc., announced today that it has developed an insulating resin material for hybrid bonding (micro bonding). The…
Scientists develop a revolutionary microelectronic device that uses 1,000 times less power than commercial memory technologies
SINGAPORE – A research team led by the Agency for Science, Technology and Research (A*STAR) in partnership with National University of Singapore (NUS) has created…
IEEE International Workshop on Chiplet Interconnect Test and Repair (CITaR)
The Hague in the Netherlands | May 23-24, 2024 | The first IEEE International Workshop on Chiplet Interconnect Test and Repair (CITaR) focuses exclusively on…
ECTC 2024 – IEEE 74th Electronic Components and Technology Conference – May 28-31 – Denver, CO
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology…