Large-size multi-layered fan-out RDL multi-chip module packaging By Nicholas Kao, Jay Li, Jackson Li, Yu-Po Wang[Siliconware Precision Industries Co., Ltd] This article was published in…
Sustaining Moore’s Law with graphene
Since the invention of metaloxide-semiconductor(MOS) integrated circuits in the early 1960s, the speed, capacity, and complexity of the chips have increased dramatically, roughly following Moore’s…