The semiconductor and MEMS sensor industry is rapidly growing. Every day, new applications, next-generation materials, and state-of-the art information gathering sensors are being created. Each new device must be packaged and electrically connected to the outside world. A robust and reliable interconnect is critical to the success and function of every integrated circuit, sensor and device. Advanced technologies, new manufacturing technologies and novel materials come with unique challenges when it comes to making robust and reliable interconnects.
Cover image courtesy of SMART Microsystems Ltd.
San Jose, CA – November 8, 2016 – The 13 th International Wafer-Level PackagingConference (IWLPC) and Exhibition,held in Silicon Valley on October 18-20, offered an excellent insight into current issues and future challenges in advanced packaging technologies.An impressive array of 48 presentations, five interactive presentations (poster sessions), and four workshops covered a wide array of topics with focus on various aspects of fan-out wafer-level packaging (FOWLP) ...>>