July • August 2016; Volume 20, Number 4
Eutectic bonding is an area of particular interest to photonics, microwave and RF electronics, because of the need for a clean,highly thermally efficient process, as well as for long-term reliability. Increasing demand for communications data and bandwidth accelerates the adaptation of full automation and the improvement of processes in advanced eutectic packaging for volume production.These advances result in high-precision, high-throughput, improved yield, and new products for the component and module manufacturers.
Photo courtesy of MRSI Systems
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A*STAR’S IME LAUNCHES CHIP-ON-WAFER CONSORTIUM II AND COST- EFFECTIVE INTERPOSER CONSORTIUM TO ADVANCE CHIP PACKAGING SOLUTIONS FOR HIGH-VOLUME MANUFACTURING
Tokyo, Japan and St. Petersburg, FL - May 31, 2016 — DISCO Corporation, the world's largest dicing equipment provider, has signed a global distribution agreement with Plasma-Therm for its plasma dicing technology, the companies announced on May 31, 2016
Piscataway, NJ – May 24, 2016 – The IEEE Components, Packaging and Manufacturing Technology Society (CPMT) will recognize its 2016 award winners at the 66th Electronic Components
San Jose, CA - May 18, 2016 - VLSI announces 10 BEST semiconductor equipment supplier rankings for 2016.
19 of the 20 10 BEST suppliers have achieved greater than an 8.0 rating this year. ...>>
Taipei, Taiwan (Sep 7-9) - SEMICON Taiwan is the premier event in Taiwan for microelectronics manufacturing. Connect with the companies, people, products and information shaping the future of design and manufacturing for semiconductors, nanoelectronics, MEMS, Photovoltaics and related advanced electronics.
Stuttgart, Germany (Sep 15-16) - The European MEMS Summit was born from a need expressed by the industry to have a high-level event platform to present ideas and exchange viewpoints on MEMS technologies, manufacturing and business challenges. SEMI, already active in MEMS and with a proven track record in microelectronics, has answered this need by reinforcing its dedication to MEMS and by launching a new flagship event to focus on MEMS: the European MEMS Summit.