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September • October 2018; Volume 22, Number 5

Cover Photo

The ZEISS Xradia 520 Versa X-ray microscope (XRM) provides non-destructive package-level failure analysis and 3D volumetric and linear measurements on packaging structures with submicron resolution. The photo, taken inside the XRM chamber, shows a loaded sample being prepared for measurement just after placement by the robotic arm. The XRM system collects 2D projection images from the rotating sample, which is positioned between an X-ray source and detector, and then uses proprietary software to reconstruct 3D volume data that may be visualized and analyzed. Scintillator-coupled microscope objectives enable it to maintain resolution regardless of package size.

 

Cover image courtesy of Zeiss.


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Industry News

Call for Papers is now open for the 2019 IEEE Electronic Components and Technology Conference (ECTC 2019), to be held May 28 –May 31, 2019, at The Cosmopolitan of Las Vegas, Nevada, USA. 2019

ECTC Abstract Submission Deadline is October 8
This premier international conference, sponsored by the IEEE Electronics Packaging Society (IEEE EPS), covers a wide spectrum of electronic packaging technology topics, including components, materials, assembly, interconnect design, device and system packaging, wafer level packaging, Si photonics, LED and IoT, optoelectronics, 2.5D and 3D integration technology, and reliability. ...>>

Indium Corporation Announces Partnership with MELSS

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Amkor Delivers Industry's First Package Assembly Design Kit to Support Mentor's High-Density Advanced Packaging Tools Amkor's SmartPackage™ Speeds Accurate Design and Verification of Heterogeneous Integration Package Solutions


Tempe, AZ USA - July 18, 2018 - Amkor Technology announced today it has partnered with Mentor to release Amkor's SmartPackage™ Package Assembly Design Kit (PADK), the first in the industry to support Mentor's High-Density Advanced Packaging (HDAP) design process and tools. Amkor's award-winning High-Density Fan Out (HDFO) process can now be used in conjunction with Mentor's software to deliver early, rapid and accurate verification results of advanced packages required for Internet-of-Things, automotive, high-speed communications, computing and artificial intelligence applications. ...>>

Alpha Assembly Solutions Acquires HiTech Korea CO., LTD

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EV Group begins construction of new manufacturing III building to expand production capacity

St. Florian, Austria, May 2, 2018 - EV Group (EVG) announced that it has started construction work for the next expansion phase of its corporate headquarters. The new, state-of-the-art building will house EVG's "Manufacturing III" facility, which will more than double the floor space for the final assembly of EVG's systems. ...>>

ASE Industrial Holding, Co., Ltd. completes equity exchange on the Taiwan (TWSE) and New York (NYSE) Stock Exchanges

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Singapore and Hong Kong, April 3rd, 2018 - ASM Pacific Technology Ltd. (“ASMPT”) announced that it has completed its acquisition of 100% of the shares of AMICRA Microtechnologies GmbH (“Amicra”). Amicra is a leading supplier of high-precision die bonders for the photonics and advanced packaging markets. The transaction, which completed on April 4, 2018 will bring about a strengthened business, well-placed to serve not only the fast growing silicon photonics assembly equipment market, but also the wider high-precision flip-chip and die bonding markets. ...>>

ASM Pacific Technology Ltd. signs agreement to acquire TEL NEXX, Inc.

Singapore and Hong Kong, April 3rd, 2018 - ASM Pacific Technology Ltd. (ASMPT) announced that it has signed a definitive agreement with Tokyo Electron Limited (TEL) to acquire TEL NEXX, Inc. (NEXX). The deal is expected to close when approvals from the authorities have been received. The acquisition is another major step by the Group in pursuing its growth strategy of tapping into new high-growth markets and expanding their product offerings to the semiconductor advanced packaging market. ...>>