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September • October 2018; Volume 22, Number 5

Cover Photo

The ZEISS Xradia 520 Versa X-ray microscope (XRM) provides non-destructive package-level failure analysis and 3D volumetric and linear measurements on packaging structures with submicron resolution. The photo, taken inside the XRM chamber, shows a loaded sample being prepared for measurement just after placement by the robotic arm. The XRM system collects 2D projection images from the rotating sample, which is positioned between an X-ray source and detector, and then uses proprietary software to reconstruct 3D volume data that may be visualized and analyzed. Scintillator-coupled microscope objectives enable it to maintain resolution regardless of package size.


Cover image courtesy of Zeiss.

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Industry News

Call for Papers is now open for the 2019 IEEE Electronic Components and Technology Conference (ECTC 2019), to be held May 28 –May 31, 2019, at The Cosmopolitan of Las Vegas, Nevada, USA. 2019

ECTC Abstract Submission Deadline is October 8
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ASE Industrial Holding, Co., Ltd. completes equity exchange on the Taiwan (TWSE) and New York (NYSE) Stock Exchanges

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ASM Pacific Technology Ltd. signs agreement to acquire TEL NEXX, Inc.

Singapore and Hong Kong, April 3rd, 2018 - ASM Pacific Technology Ltd. (ASMPT) announced that it has signed a definitive agreement with Tokyo Electron Limited (TEL) to acquire TEL NEXX, Inc. (NEXX). The deal is expected to close when approvals from the authorities have been received. The acquisition is another major step by the Group in pursuing its growth strategy of tapping into new high-growth markets and expanding their product offerings to the semiconductor advanced packaging market. ...>>