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March • April 2017; Volume 21, Number 2

Cover Photo

The cover shows a tool operator measuring the total thickness variation of an adhesive interlayer of a temporary bonded wafer by taking 280,000 measurement points. For thickness measurements,a high number of measurement points is needed to achieve proper accuracy. Local deviations,such as particles within the bond interface, have a significant effect on the subsequent thinning process, which can lead to wafer breakage and tool downtime.

Cover image courtesy of EV Group


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Industry News

Management Changes - Annette Burczyk and Dr. Thorsten Teutsch assume new management duties for the PacTech Group

NAUEN, Germany - As the Group has announced, Annette Burczyk and Dr. Thorsten Teutsch took over the executive management of the PacTech Group on April 1st, 2017. Heinrich Lüdeke, who held the CEO position from 2013, stepped down at the end of March and will return to his former employer NAGASE (Europa) GmbH, Dusseldorf.
“I would like to thank Heinrich Lüdeke for the commitment and good achievements he has brought to the PacTech Group,” said Mr. Takahiro Okumura, Executive Officer of the parent company NAGASE (Japan). ...>>

Tessera Holding Corporation announced name change to Xperi Corporation

Tessera Holding Corporation (Nasdaq: TSRA) announced that it changed its name to Xperi Corporation ("Xperi") and its Nasdaq ticker symbol to XPER, effective February 23. The change also included a new corporate logo and brand platform to reflect the company's expanded capabilities, continued technological innovation and refined vision. Xperi and its wholly owned subsidiaries, DTS, FotoNation, Invensas and Tessera, will continue to create and deliver audio and broadcast solutions, computational imaging technology, semiconductor packaging, and intellectual property licensing. ...>>

Smiths Interconnect launches brand transition to simplify customer access to technologies

Smiths Interconnect, a division of Smiths Group plc, recently announced it is unifying its technology brands of EMC Technology, Hypertac, IDI, Lorch, Millitech, RF Labs, Sabritec, TECOM, and TRAK under the single brand identity of “Smiths Interconnect.” ...>>

GE Ventures and Samsung Electro-Mechanics (SEMCO) recently announced a multi-year, worldwide patent license agreement

With this partnership, SEMCO will license GE’s microelectronics packaging patent portfolio, covering the fabrication of substrates embedded with electronic circuits. ...>>

Amkor Technology to acquire NANIUM S.A.

Amkor Technology, Inc. (Nasdaq: AMKR) and NANIUM S.A. have announced that they have entered into a definitive agreement for Amkor to acquire NANIUM. Terms of the transaction were not disclosed at the time of the announcement. ...>>

InvenSense and GLOBALFOUNDRIES collaborate on ultrasonic fingerprint imaging technology

InvenSense, Inc. (NYSE: INVN) and GLOBALFOUNDRIES have announced their collaboration on an ultrasonic fingerprint imaging technology for InvenSense UltraPrint Ultrasound Fingerprint Touch Sensor Solution. InvenSense and GF are enabling, for the first time, commercial manufacturing of aluminum nitride-based piezoelectric Micromachined Ultrasonic Transducers (pMUT). As a result of the close technological collaboration between InvenSense and GF, InvenSense’s CMOS-MEMS Platform can now be extended to pMUT devices and enable a biometric authentication solution for mobile and IoT products. ...>>

Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding

At the 2017 European 3D Summit in Grenoble (France, Jan 23-25), imec and EV Group (EVG) announced an extension to their collaboration, achieving excellent wafer-to-wafer overlay accuracy results in both hybrid bonding and dielectric bonding. Expanding this collaboration, EVG will become a partner in imec’s 3D integration program through a joint development agreement to further improve overlay accuracy in wafer-to-wafer bonding. ...>>

CORWIL Technology invests in portable clean environment for wafer sort

To satisfy demand for ultra-clean environments for wafer sort, CORWIL Technology (CORWIL) has added a Portable Clean Environment for wafer sort that is good to Class 1000. This is a one-stop solution from wafer sort, die prep, assembly, package test and reliability that provides the ability to understand how different pieces of the backend process affect each other in terms of yield. ...>>

Honeywell technology: keeping smartphones cool

Honeywell (NYSE: HON) has announced the availability of a thermal interface materials (TIM) solution to help smartphone manufacturers and designers effectively manage heat dissipation in their phones. Honeywell pointed out that the worldwide smartphone market is expected to reach more than 1.9 billion units by 2020, according to a study from IDC Research. In addition, data needs are growing at unprecedented rates. To meet this challenge, the smartphone industry is leveraging technology that enables phones to provide optimal processing performance without overheating. ...>>

Reflections on IWLPC

By Louis Burgyan [LTEC Corporation]

San Jose, CA – November 8, 2016 – The 13 th International Wafer-Level PackagingConference (IWLPC) and Exhibition,held in Silicon Valley on October 18-20, offered an excellent insight into current issues and future challenges in advanced packaging technologies.An impressive array of 48 presentations, five interactive presentations (poster sessions), and four workshops covered a wide array of topics with focus on various aspects of fan-out wafer-level packaging (FOWLP) ...>>

Industry Events

15th Annual MEMS & Sensors Technology Symposium

San Jose, CA, USA – June 6, 2017 – Much has changed over the last 15 years in the electronics industry, one of the most significant being the incredible growth of MEMS enabled sensors. The use of sensors in mobility applications has increased by more than 1000-fold over the last decade alone. ...>>
The Burn-in and Test Strategies (BiTS) Workshop held its 18th annual North American event March 5-8 in Mesa, AZ. The event was attended by more than 240 test engineers and managers from around the world, representing more than 100 companies including top foundries, fabless, and integrated device manufacturers and outsourced subassembly and test suppliers (OSATS), as well as suppliers of equipment and consumables to the semiconductor industry. In total, more than 400 people participated in this year’s event. ...>>
The biggest event for the semiconductor industry in Korea — SEMICON Korea — celebrated its 30th anniversary this year. The event took place February 8-10, 2017, at COEX in Seoul. It featured approximately 600 exhibiting companies and 40,000 attendees along with keynote speeches, the SEMI Technology Symposium (STS), Test Forum, Market Seminar, Smart Manufacturing Forum, System LSI Forum, Metrology Inspection Forum, and the Supplier Search Program. ...>>
The 2017 SMTA Pan Pacific Symposium (held at Sheraton Kauai Resort in Koloa, HI, USA) included over 50 presentations on new technology trends in the electronics manufacturing industry. The intimate setting of the symposium provided ample opportunity for attendees to make quality professional connections during a variety of social activities such as the golf tournament, welcome reception, and private luau. ...>>
IEEE’s 67th Electronic Components and Technology Conference (ECTC) will be held at the Walt Disney World Swan & Dolphin Resort, Lake Buena Vista, Florida, from May 30 to June 2, 2017. This premier international annual conference, sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society, brings together key stakeholders of the global microelectronic packaging industry, such as semiconductor companies, foundry and OSAT service providers, equipment manufacturers, material suppliers, research institutions and universities, all under one roof. More than 1,400 people attended the 66th ECTC in Las Vegas, Nevada, in May 2016. ...>>