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July • August 2019; Volume 23, Number 4

Cover Photo

Data centers (i.e., AI, machine learning, deep learning, computation run-off data center hardware) are driving next generation semiconductor packaging, especially 2.5D and 3D integrations. In particular, data centers are the primary target market for 3D DRAM, 3D NAND for SSDs, and 2.5D CPU/GPU/FPGA/SoCs, etc. These devices are the focus of all the large semiconductor companies for not only their current high-end product lines, but also those of the future.


Cover art courtesy: XPERI Corporation

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International Wafer-Level Packaging Conference (IWLPC)
Program Announced and Registration Now Open

"Advanced Packaging in the New Connected World"

Chip Scale Review and SMTA are pleased to announce the program for the 16th annual International Wafer-Level Packaging Conference (IWLPC). The conference will be heldOctober 22-24, 2019 at the DoubleTree by Hilton Hotel in San Jose, California USA.

The technical sessions on Tuesday and Wednesday are organized into three tracks: Wafer-Level Packaging, 3D Packaging, and Advanced Manufacturing and Test.The Wafer-Level Packaging (WLP) track features sessions on materials, reliability, metrology, processing, and new technology, such as Fan-Out WLP.

The 3D Packaging track features sessions on design, test, characterization, wafer bonding, chip stacking, and processing for Fan-Out. The Advanced Manufacturing track features sessions on process materials, equipment, inspection, and more.

Registration for IWLPC is now available online. Discounted rates are available for conference registration made on or before September 27, 2019.

Visit for more information. Contact Jaclyn Sarandrea at +1-952-920-7682 or with questions.

White Paper: System-level, post-layout electrical analysis for high-density advanced packaging
As HDAP designs become more popular, the need for post-layout simulation (analog) and post-layout STA (digital) flows to augment basic physical verification (DRC and LVS) is growing. Mentor provides an accurate, automated flow that generates the required HDAP netlist for simulation/STA to enable HDAP designers to ensure that the HDAP will perform as designed.
Mentor, a Siemens Business

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