May • June 2018; Volume 22, Number 3
Advanced packaging techniques like FOWLP demand mature lithography solutions for the challenging processes required to manufacture high-performance devices. The Veeco-Ultratech AP300®, which was used for the research in the featured article, has a variable numerical aperture lens that can be optimized to maximize depth of focus while maintaining higher resolution performance. It can process wafers with up to 7mm of warpage and is configurable with an optical system that provides a full wafer topography map to help optimize the focus position for each exposure.
Cover photo courtesy of Veeco Instruments Inc.
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We help fabless IC companies miniaturize and productize their chip-level designs into MMICs, CMOS, SiGe, GaAs, InP, GaN or SiC Multiple-Chip Modules, 100-400Gbps Optoelectronic Packages or RF/Microwave Board Assemblies.
San Jose, California – USA –
The IWLPC Technical Committee is pleased to announce the Best of Conference, Best Presentation & Best Papers in WLP, 3D, Advanced Manufacturing and Test tracks as chosen by the technical committee and attendees based on technical merit, relevance, originality, knowledge of subject, quality of material, and quality of presentation.
GRENOBLE, France – Nov. 28, 2017 – Leti,
a technology research institute of CEA Tech, today announced that Emmanuel Sabonnadiere has been named CEO, succeeding Marie-Noelle Semeria.
Sabonnadiere, who has more than 25 years of executive leadership experience in a variety of large technology environments, joins Leti from CEA Tech, where he led the industrial-partnership program. He brings a strong background in new-technology development with broad private-sector expertise in operational excellence, team building and guiding multicultural organizations in business transformation in Europe and globally.
As in prior years, the in-depth presentations at this year's IWLPC, covering a broad array of the industry's critical challenges, did not disappoint. A series of keynote presentations and papers included a couple of major announcements that will be discussed below. Of special note, several keynote speakers focused on heterogeneous integration and the added complexities of migration to large rectangular panels. The session presentations reported impressive progress in material science, manufacturing processes, new equipment, metrology, and testing. A few selected highlights, only limited by the allotted space, are included below.
Industry Outlook and Technology Trends in IC Packaging Market
Andrea Lati, Director of Market Research
VLSI Research ...>>