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during testing) after they are assembled.
        There is no underfill between the
        package and the PCB.
          Fif teen boards (each with four
        packages) are used for the temperature
        cycling tests. The sample size is 60
        fan-out  packages.  Thermal cycling
        is performed in a Votsch 7027-15
        environmental chamber as shown in
        Figure 3a. The temperature input to
        the chamber (measured in the air of the
        chamber) goes from room temperature to
        85ºC and stays there for 15 minutes; the
        temperature then ramps down to -40ºC
        and stays there for 15 minutes and then
        ramps up again to 85ºC and stays there
        for 15 minutes, and so forth. The ramp
        up and ramp down times are 15 minutes
        each. The cycle time is one hour, i.e., one
        hour per cycle. The acquisition system is
        an Agilent 30970A data logger as shown
        in Figure 3b.
          The Weibull cumulative distribution   Figure 3: a) Thermal cycling chamber and samples; b) Data acquisition system; c) Weibull plot of the thermal
        function  F(x), reliability function   cycling results for the fan-out package with lead-free solder joints on a PCB without underfill.
        R(x), failure rate  h(x), and mean-  early failure at 58 cycles). The failure   assembly increases by 50%. The cycle at
        time-to-failure (MTTF) are given by,   criterion is when the resistance of the   which the first solder joint of the package
        respectively [5]:                  daisy-chain of the PCB fan-out package   failed is considered as the cycle-to-failure










          and




        where x is the random variable (e.g., life
        or cycles), γ is the expected minimum
        value of x (it is also referred to as the
        location parameter), θ is the characteristic
        value (at 63.2% failures) or the scale
        parameter, which could  be  used to
        represent the quality of a product, and β is
        the Weibull slope, or the shape parameter,
        which is a measure of the uniformity of a
        product (the larger the slope, the more
        uniform the product). It is frequently
        reasonable to assume that the expected
        minimum  value  of  life  (γ)  of  the
        population, i.e., the lower bound of life of
        the population, is equal to zero, then we
        have the two-parameter (θ, β) Weibull
        distribution. Г is the gamma function.
          The thermal cycling test of the lead-
        free fan-out package stops at 1,100 cycles
        and there are 14 failures (including one


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