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INDUSTRY NEWS
IWLPC 2020 will be an online event!
The International Wafer-Level Packaging Conference and Exposition
featuring over 50 on-demand technical presentations and interactive exhibit
hall will open at 8:00am on October 13th (U.S. PST), with on-demand
access until Friday, October 30th.
Announcing the IWLPC 2020 Virtual Keynote presentation by Dr. Dan Oh, Ph.D. “Trends, Challenges, Opportunities in Advanced
Packaging for Smart Computing Era”
Dr. Dan Oh is an During this time, Dr. Oh helped and signal and power integrity fields
Engineering VP of establish an advanced wafer-level with multiple high-tech companies,
t h e Te s t , S y s t e m packaging laboratory for developing i n c l u d i ng I n t e l , R a m bu s , a n d
and Package (TSP) high-end server products such as 2.5D Synopsis.
u n i t a t Sa m s u ng Silicon/RDL interposers, FO-WLP and His dedication to his work has led
Electronics. 3D TSV devices. to over 90 patents, patent applications,
He is responsible He also helped research and grow and over 160 published papers in
fo r d e ve l o p i n g FO-PLP technology for consumer and IEEE journals and conferences.
sig n al a nd p owe r mobile products commercializing the He is also the lead author of the
i n t e g r i t y a n d world’s first FO-PLP product for the book High-speed Signaling: Jitter
thermal solutions for memory, S. LSI Galaxy watch. Modeling Analysis and Budgeting.
and foundry devices. D r. O h r e c e ive d h i s Ph . D. i n Learn About the Virtual Experience
From 2016 to the end of 2019, Dr. Oh ele c t r ic a l e ng i n e e r i ng f r o m t h e – www.iwlpc.com
led the Package Development department U n i ve r s i t y of I l l i n o i s , U r b a n a -
responsible for both research and Champaign in 1995. He has over 30
development of entire Samsung products. years of experience in the packaging
2020 ECTC
Virtual for the
1st Time Reached
Record Numbers
By Rozalia Beica, AT&S Austria,
71st ECTC Vice General Chair
T he 70th annual Electronic,
C om p o ne n t s a n d
Tech nolog y Conference
(ECTC) sponsored by the
E-Tec Interconnect AG, Mr. Pablo Rodriguez, Lengnau Switzerland IEEE Electronics & Packaging Society
Phone : +41 32 654 15 50, E-mail: p.rodriguez@e-tec.com (IEEE EPS) was a huge success! For
the first time, the event took place
virtually, providing the opportunity to
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