Page 51 - ChipScale_Jul-Aug_2020-Digital

take our favorite packaging conference global, directly into © 2017 Brewer Science, Inc.
our attendees’ and participants’ homes and offices. Initially
planned to take place from June 3-30 – due to high demand Creating Safe
– the event was extended and ended on July 7, 2020. This
year, the conference had over 400 presentations by authors
from 21 countries organized in 45 technical sessions and 7
special sessions. Environments
The 345 presentations given as part of the 45 technical
sessions were selected from 499 abstracts submitted for this
year’s conference. While the sessions on fan-out wafer- and Laser Release System
panel-level packaging and 2.5D/3D integration continued
the trend as the biggest hits, the virtual format enabled us to In the laser release system, the device wafer
identify several other topics of high interest and attendance
i nclud i ng: W LCSP, 3D Pa ck ag i ng, Emb e d de d a nd is bonded to a transparent glass carrier using
Heterogeneous Integration, Advanced Bonding and High- a bonding material and a release material.
Density RDL, High-Performance Computing, Antenna-in-
Package and Materials for 5G, as well as Automotive and Once processing is completed, the pair is
Power Electronics Packaging. separated by exposing the release material
T he key note present at ion
was the star of the conference, with an excimer laser or solid-state laser. Low-
having the highest attendance stress separation coupled with high throughput
of nearly 2000 views. Even
though this high attendance is a make the laser release system suitable for all
record number in the history of production environments.
ECTC, it does not really come
as a surprise, considering the
caliber of the keynote speaker
we had this year and the very
relevant topic presented. We Transparent Laser
Doug Yu, Ph.D are very honored and thankful Carrier Thin Device Wafer
to Dr. Doug Yu from TSMC
for giving an exceptional presentation entitled, “Innovative Release Layer Bonding Material
Heterogeneous Integration Technologies Initiate a New Era.”
The Special Sessions, which had 60 invited international
experts from industry, academia and research institutes,
were all a big hit and highly attended. The Plenary Session,
“3DIC: Past, Present and Future,” chaired by Michael
Mayer from the University of Toronto (Canada), has drawn
the attention of over 1000 attendees and brought together
a powerhouse speaker lineup of industry veterans. Our Laser Release System Benefits:
keynote speaker, Doug Yu from TSMC (Taiwan), together •Highest-throughput system available with a
with Eric Beyne from imec (Belgium), Mitsumasa Koyanagi
from Tohoku University (Japan), Paul Franzon from North release time of less than 30 seconds
Carolina State University (USA), and Peter Ramm from •Ultraviolet laser does not heat or penetrate
Fraunhofer Research Institute EMFT (Germany), addressed
the evolution of 3D integration and highlighted the new the bulk bonded structure
applications and opportunities for using 3DIC technology, •Low-stress processing through use of CTE-
as well as challenges along the value chain.
The “Cutting-Edge Technology on Integrated Photonics matched carrier and room temperature
and Packaging” session, chaired by Harry Kellzi from separation
Micropac Industries (USA), had over 800 views. Continuing
the tradition, we again brought to ECTC the Heterogeneous Compatible with: 308 nm 343 nm 355 nm
Integration Roadmap workshop, which was chaired by
Amr Helmy (University of Toronto), Bill Bottoms (3MT
Solutions), Ravi Mahajan (Intel), Tom Salmon (SEMI), and
William Chen (ASE). Also of great interest was the EPS www.brewerscience.com
Seminar entitled, “Future Semiconductor Packages for

49
Chip Scale Review July • August • 2020 [ChipScaleReview.com] 49