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Artificial Intelligence Hardware”— all of them. IEEE EPS, which is pleased to see the high level of global
chai red by Yasu m itsu Or ii f rom the sponsoring organization of this participation in ECTC. Building off
Nagase (Japan) and Shigenori Aoki event, together with IEEE Event the successful ECTCs of previous
f rom Fujit su (Japa n). Pavel Roy Emergency Response Team (EERT) years, we were thrilled to welcome
Paladhi and Nicholas Bronn from IBM and Meetings, Conferences and Events 7,704 attendees this year, by far, our
chaired a special session covering (MCE) representatives, have been highest participation ever.”
“Bridge to Quantum Computing.” instrumental in helping us navigate
We expa nded t he focus of ou r through the changing global situation. Mark your calendar for the 71st
Diversity and Career special session We had an overwhelming positive ECTC
this year to address relevant and current feedback from our sponsors, speakers Planning is already underway for
inclusion-focused topics in our industry. and attendees, and would like to take the 71st ECTC, which will be held
This session, jointly organized by this opportunity to thank everyone June 1-4, 2021, at the Sheraton San
ECTC and ITherm, entitled, “Diversity involved for helping make this year’s Diego Hotel & Marina in San Diego,
and Inclusion Drives Innovation and c on f e r e nc e CA. The f irst call-for-papers has
Productivity,” was chaired by Kitty possible and a been issued, the abstract submission
Pearsall (Boss Precision) and Cristina huge success! process will open on August 15, 2020,
Amon (University of Toronto) and General Chair and abstracts must be received by
focused on specifics of inclusion in a Dr. Chris Bower October 4, 2020. For more information
diverse workforce. o f X D i s p l a y visit ectc.net.
The organization of this conference C o m p a n y
encompasses year-long activities c o m me n t e d ,
of a rou nd 250 i nd u st r y ex p e r t s “Considering the
volunteering their time—a big thank circumstances,
you and appreciation goes out to we we r e ve r y Chris Bower, Ph. D

Virtual Conference and Expo

On-Demand Conference & Expo: October 13-30, 2020
Live Virtual Exposition: October 13-14, 2020

IWLPC is now in its 17th successful year as a well-established
international conference, boasting annual representation from
over 19 countries. The technical program and exhibition focus on
semiconductor packaging and advanced wafer-level packaging
technology featuring 3 tracks in WLP, 3D Integration, and
Advanced Manufacturing and Test. This year is a continuation of
Bridging the Boundaries: Wafer, Panel and Beyond reflecting the
enablement of 5G communications, AI, and IoT, automotive and
more.
Who do I contact with any additional questions?
For conference attendees and speakers, contact: jaclyn@smta.org
For exhibitors, sponsors and advertisers, contact: mckenna@smta.org
www.iwlpc.com

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