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Acknowledgements
MicroLeadFrame, MLF and rtMLF are registered
trademarks of Amkor Technology, Inc. This article was
originally presented at the 2022 IEEE 24th Electronics
Packaging Technology Conference (EPTC) and has been edited
for publication in Chip Scale Review.

Biographies
DaeYoung Park is a Researcher, Advanced Maintstream Development, R&D, at Amkor Technology Korea, Inc., Incheon,
Republic of Korea. Email daeyoung.park@amkor.co.kr;

Hyeongll Jeon is Senior Director, Advanced MS Development Project Leader at Amkor Technology Korea, Inc., Incheon,
Republic of Korea.

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