Page 54 - ChipScale_Mar-Apr_2020-digital

Figure 10: A SEM cross section of the packages after long-term reliability Figure 11: LAB used to attach DRAM with AP. Cross-section data shows very good
tests. solder joints.
than TCB, but is still lower than standard MR. It fixes most of the problems that we have Acknowledgments
in MR and TCB. Cost wise, LAB is comparable with MR for most designs. As the pitch The authors would like to thank
size shrinks with the Si node, LAB is expected to be the “must have” technology for the the R&D team of JCET group, Korea,
5nm and 3nm devices of the future. and our customers for their continued
guidance in the study. The authors
also want to express gratitude to the
individuals at our partner companies that
helped design the advanced packages
and process.

References
1. Islam, et al., “Fine-pitch Cu pillar
with bond on lead (BOL) assembly
challenges for low-cost and high-
performance flip-chip package,” 67th
Elec. Comp. and Tech. Conf. (ECTC),
Lake Buena Vista, FL, May 30–June
2, 2017.
2. M.-C. Hsieh, C.-Y. Chen, I. Hsu, S.
Lin, KT. Kang, “10nm CPI study for
fine-pitch flip-chip attach process
and substrate,” 5th Micro/Nano-
Electronics Pkg. & Assy., Design and
Mfg. Forum (MiNaPAD), May, 2017,
Grenoble, France.
3. C.-Y. Chen, I. Hsu, DS. Park, M.-
C. Hsieh, “Laser-assisted bonding
technology enabling fine bump pitch
in flip-chip package assembly,” 7th
Elec. System-Integ. Tech. Conf.
(ESTC), 2018, Sept. 18-21, Dresden,
Germany.
4. N. Islam, et al., “Advancement of
E-Tec Interconnect AG, Mr. Pablo Rodriguez, Lengnau Switzerland fine-pitch interconnect technology,”
Phone : +41 32 654 15 50, E-mail: p.rodriguez@e-tec.com
IMAPS Device Pkging. Conf.,
Scottsdale, AZ, Mar. 4-7, 2019.

Biographies
Nokibul Islam is currently serving as Director of Field Applications Engineering at JCET Group, with
the main focus in product business development and marketing for the company. Before joining JCET, he
was part of Amkor Technology’s Research and Development team. He has over 17 years of experience in
the semiconductor industry and received his PhD in Mechanical Engineering from Auburn U., AL. Email
nokibul.islam@jcetglobal.com
KyungOe Kim is a Director in R&D at JCET Group Korea.

52
52 Chip Scale Review March • April • 2020 [ChipScaleReview.com]