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of inclusion in a diverse workforce and will professional or an executive, ECTC also like to take this opportunity to thank
take place on Wednesday, May 27 at 6:30 offers something unique for everyone our sponsors, exhibitors, authors, speakers,
p.m. After this panel, starting at 7:30 p.m., in the microelectronics packaging and PDC instructors, session chairs, and
Michael Mayer will chair the ECTC Plenary components industry. As the Program Chair program committee members, as well as
Session entitled, “3DIC: Past, Present and of this premier event, I invite you to make all the volunteers who help make the 70th
Future.” In this plenary session, experts your plans now to join us and to be a part of ECTC a success. I look forward to meeting
will address the evolution and challenges all the exciting technical and professional all of you in Lake Buena Vista, Florida, on
of 3D integration, new applications, and opportunities offered at this event. I would May 26 –29, 2020.
opportunities driving further adoption of
3DIC technology across the value chain.
Following the industry trends and a
growing interest in photonics, we are
increasing our activities in this area. This
year we are bringing two Special Sessions
focused on photonics, in addition to the
presentations offered in the technical
sessions. On Tuesday, May 26 at 2 p.m., 500 µm
Rena Huang and Harry Kellzi will chair
the 1st Special Session entitled, “Cutting-
Edge Technology on Integrated Photonics
and Packaging.” On Thursday, May 28 at
9 a.m., Xiaoming Yu will chair the 2nd
Special Session on Photonics entitled,
“Research, Manufacturing and Applications
of Advanced Photonics Technologies within
Florida Photonics Cluster.” The program
will offer several opportunities for the
photonics community to learn about the
recent developments and progress related
to the design, research, manufacturing, and
applications of photonics technologies.
On Thursday, May 28, at 8 p.m. our
colleagues from Japan, Yasumitsu Orii and
Shigenori Aoki, will be chairing the IEEE
EPS Seminar entitled, “Future Semiconductor
Packages for Artificial Intelligence
Hardware.” The seminar will focus on brain- Precision Glass Processing Service
inspired devices and integration technologies.
In addition to the technical and special
sessions and panels, the 70th ECTC event will Vitrion’s Laser-Induced-Deep Etching (LIDE) technology enables the
also offer several professional development economical production of deep microfeatures in technical glasses.
courses (PDCs) and Technology Corner With our production service we address customers with any production
exhibits. Co-located with the IEEE ITherm quantities. We are happy to support you with your R&D projects.
Conference, the 70th ECTC will offer eighteen
PDCs, organized by the PDC Committee
chaired by Kitty Pearsall and Jeffrey Suhling. Unlock the Full Potential of Glass: LIDE Samples
The PDCs will take place on Tuesday, May • Through Glass Via (TGV) Wafer
26 and are taught by distinguished experts in • Embedding Wafer
their respective fields. The Technology Corner • Spacer Wafer
exhibits will showcase the latest technologies • Capping Wafer R&D and Qualification
and products offered by leading companies
in the electronic components, materials, Volume Production
packaging, and services fields. More than one Find out more:
hundred Technology Corner exhibits will be www.vitrion.com/semiconductor
open Wednesday and Thursday starting at 9
a.m. ECTC also offers attendees numerous
opportunities for networking and discussion
with colleagues during coffee breaks, daily
luncheons, and nightly receptions.
Whether you are an engineer, a manager,
a student, or a business and marketing

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