Page 56 - ChipScale_Mar-Apr_2020-digital

INDUSTRY NEWS

2020 ECTC to focus on the latest

technologies, emerging applications

By Rozalia Beica, AT&S, 70th ECTC Program Chair

As we monitor the COVID-19 outbreak, normal preparations are underway for the 70th ECTC to be held
O n behalf of the Program and annual conference brings together key reliability studies will bring new perspectives
May 26-29 at the Walt Disney World Swan and Dolphin Resort in Lake Buena Vista, Florida.
Visit ectc.net for latest status.
and challenges from materials and processing
Executive Committees, it
stakeholders of the global microelectronic
is my pleasure to invite you
assembly and manufacturing. Interactive
and electronics manufacturing companies,
to IEEE’s 70th Electronic packaging industry, such as semiconductor perspectives, integration, interconnections,
Components and Technology Conference design houses and foundries, outsourced presentation sessions will showcase papers
(ECTC). We are very excited about the semiconductor assembly and test (OSAT) in a format that encourages more in-depth
2020 program and we are welcoming our service providers, substrate makers, discussion and interaction with authors
colleagues from all over the world to join equipment manufacturers, material suppliers, about their work. Authors from over twenty
us. The 70th edition of ECTC, sponsored research institutions, and universities—all countries are expected to present their work at
by IEEE/EPS, will take place at Walt under one roof. the 70th ECTC, covering ongoing technology
Disney World Swan and Dolphin Resort Over 200 volunteers and industry experts, development within established disciplines or
in Lake Buena Vista, Florida, USA from from across the supply chain, have put emerging topics of interest for our industry.
May 26-29, 2020. together an exceptional program consisting This year we have increased the number
Considered the premier electronic of 380 technical papers in 36 technical of special sessions and panel discussions.
packaging conference of the industry, with sessions and 5 Interactive Presentation The conference will feature seven special
over 1500 attendees, ECTC is continuing sessions, 18 Professional Development sessions with invited industry experts
its tradition in bringing the latest IC Courses and several panels, special sessions, that will cover emerging technologies and
packaging, components and microelectronic receptions and networking opportunities. applications. On Tuesday, May 26 at 9:30
system technologies. This international The conference will address various a.m., Pavel Roy Paladhi and Nicholas Bronn
important topics and will chair a special session covering “Bridge
industry trends, from to Quantum Computing.” On the same day
mobile, wearables at 7:30 p.m., the ECTC Panel Session will be
a nd automot ive chaired by IEEE EPS President Christopher
a p p l i c a t i o n s , Bailey and Board of Governors Member
f le x i b le a n d Karlheinz Bock. This will be a session where
printed electronics, selected young researchers will have the
t o h i g h- s p e e d opportunity to share their visions of future
communications, packaging technologies and participate in
wireless, photonics, discussions with experts in the field.
high-performance Our prestigious luncheon keynote
an d q u an t u m presentation on Wednesday, May 27,
computi ng, and will feature Douglas Yu from Taiwan
artificial intelligence Semiconductor Manufacturing Company.
(AI) hardware. The Dr. Yu will focus on i n novative
oral presentations heterogeneous integration technologies
and panel discussions starting a new semiconductor era.
will feature a wide We are continuing our tradition and
range of packaging bringing back the networking events focused
technologies, from on young professionals and diversity. Adeel
w i r e b o nd i n g, Bajwa will chair on Tuesday, May 26, from
wafer- and panel- 6:30p.m. the Young Professional Panel. This
level packaging, is a great networking opportunity for young
flip chip, 2.5D and engineers, researchers, and students, to meet
3D integration, to senior EPS members and professionals,
advanced substrates learn more about industry activities, receive
and interposers, career guidance, and engage through a
e m b e d d e d series of activities.
t e c h n o log i e s , The Diversity special session – started
system in package a few years ago as a women-focused panel
and heterogeneous – has now evolved into a Diversity and
integration. New Career focused Panel and Reception, jointly
ide a s , de sig n s , organized by ECTC and ITherm. The panel,
characterizations, chaired by Kitty Pearsall and Cristina Amon,
simulations and will have a focus on some of the specifics

54 Chip Scale Review March • April • 2020 [ChipScaleReview.com]
54