Page 47 - Chip Scale Review_Jul Aug_2022-digital

high speed and RF included presentations during the conference and afterwards Crew mentor initiative, which is actively
covering the unique challenges fueling high- on the virtual platform. Throughout the connecting women technologists with
speed digital testing and multisite testing for schedule, SWTest 2022 attendees had experienced professionals to support their
5GmmWave devices. From this session, the ample time and numerous opportunities for career development. Additionally, SWTest
Technical Program Committee awarded the networking and discussions during the long supported the attendance of four students
“Best Data Presentation” awards to Daniel breaks, daily meals, and nightly social and through the William Mann Student Travel
Bock, Ph.D. (FormFactor Inc.) for his work hospitality events. The SWTest Team was Grant Program that is partially subsidized
on “High Speed Digital: How to Optimize excited to continue promotion of the SWT- by the annual fundraising golf tournament.
a Probe Card for PAM4 to a Non-50Ω
Device,” and to Peter Cockburn (Cohu, Inc.),
who discussed “55GHz Octal-site Wafer
Test Probe Card for 5GmmWave devices.”
From Tuesday’s session on New Probe
Technologies, the “Best Presentation,
Tutorial in Nature,” was awarded to a
hybrid presentation made by Salvatore
de Siena (Technoprobe S.p.A. – Italy)
and Erwin Verardi and Alberto Pagani,
Ph.D. (STMicroelectronics – Italy) who
presented on “Copper Pad Probing with
Vertical Technologies Featuring Hard
Metal Tip: ARIANNA™ Probe Family.”
From the Pads, Bumps, and Defect session
on Wednesday, the ”Most Inspirational
Presentation” was awarded to Francesco
Lorenzelli (imec – KU Leuven, Belgium)
who provided key insights on “Shifting
Defect Detection in Quantum Chips From
Cryogenic to Ambient Temperature.”
The “People’s Choice” was voted on
by attendees in real time via the mobile
app and was received by David Raschko
(FormFactor, Inc.), who discussed the
“Advances in Vertical Probing for High-
Speed Digital Test at Wafer Sort.” From
all of the excellent presentations delivered
during the conference, the Technical
Program Committee was pleased to award
the “Best Overall Presentation” to Oliver
Nagler, Ph.D. (Infineon Technologies,
Germany) for his team’s work on “An
Advanced Method for Pad Stack Crack
Assessment during Probe-Over-Active-
Area.” Chip Scale Review, the SWTest
Media Partner, has selected the two Best
Data Presentations and the Best Overall
Presentation for publication as full articles
in upcoming issues.
The SWTest EXPO, which annually
attracts key suppliers to the wafer probe
industry and support infrastructure,
brought together 50 key exhibitors in
person and on the virtual platform that
play integral roles for the industry. At
SWTest, the Expo and the technical
program do not compete, so the attendees
were easily able to attend both events

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