Page 51 - Chip Scale Review_Jul Aug_2022-digital

Figure 2: Great networking events: it’s never too early to start attending ECTC!
special sessions and panel discussions. Very well attended and with • Chaired by Amr Helmy of University of Toronto, Canada,
international participation by experts and executives across the supply that covered “Selected Topics of IEEE EPS Heterogeneous
chain, the special sessions and panel discussions featured deep-dive Integration (HIR);”
discussions on technology developments, emerging applications, • ECTC/ITHERM Women’s Panel
different perspectives, business and industry insights and trends, as • Co-chaired by Kim Yess of Brewer Science and Francoise
well as career, diversity and workplace retention topics, such as: Von Trapp, of 3D InCites, U.S., and Cristina Amon of
University of Toronto, Canada, on “Solving Diversification
• ECTC Panel Session Challenges and Workforce Retention Issues;”
• Co-chaired by IEEE EPS President Kitty Pearsall of • ECTC/ITHERM Young Professionals Special Session
Boss Precision, U.S. and Christopher Riso of Booz Allen • Chaired by Yan Liu of Medtronic, Inc., and Adeel Bajwa of
Hamilton, U.S. on “State-of-the-Art Heterogeneous Kulicke & Soffa, U.S., a networking panel focus on career
Integrated Packaging Program (SHIP
– DoD Program);”
• ECTC Plenary Session
• Co-chaired by Rozalia Beica of
AT&S, China, and Jean-Christophe
Eloy of Yole Group, France,
the session addressed “Digital
Transformation – The Cornerstone of
Future Semiconductor and Advanced
Packaging Growth;”
• IEEE EPS Seminar
• Co-chaired by Yasumitsu Orii of
Nagase, Japan and Shigenori Aoki of
Lintec, Japan, on the “Interconnect
Technologies for Chiplets;”
• ECTC Emerging Technologies Technical
Sub-Committee Special Session
• Co-chaired by Chukwudi Okoro
of Corning and Benson Chan of
Binghamton University, U.S. on
“Micro-LED Display Technologies
High-Volume Manufacturing (HVM)
Progress and Challenges;”
• ECTC Assembly & Manufacturing
Technologies Technical Sub-Committee
Special Session
• Chaired by Jan Vardaman of
TechSearch International, U.S.
on “Meeting Next-Generation
Packaging Challenges: Chiplets to
Co-Packaged Optics;”
• ECTC Heterogeneous Integration
Roadmap Special Session

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