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Figure 3: 2022 ECTC Executive Committee: top row from left to right: Eric Figure 4: 2023 ECTC: We are looking forward to seeing you at JW Marriott
Perfecto (Publications Chair), Pat Thompson (Finance Chair), Wolfgang Sauter Orlando, Grande Lakes in Orlando, Florida.
(Sponsorship Chair), Przemyslaw Gromala (IT Coordinator), Ibrahim Guven
(Vice-General Chair), Alan Hufmann (Exhibit Chair), Karlheinz Bock (Program all our participants and contributors for their strong and continued
Chair), Florian Herrault (Assistant Program Chair), Tom Reynolds (Treasurer), support. Special thanks to the Executive Committee and IEEE EPS
Michael Mayer (IT Coordinator); front row, from left to right: Annette Teng sponsoring organization for their strong commitment and support in
(EPS Representative), Kitty Pearsall (PDC Chair), Lisa Renzi Ragar (Conference making this year’s conference a wonderful event (Figure 3).
Management), Nancy Stoffel (Jr. Past General Chair), Henning Braunisch Looking forward, the 73rd ECTC will be held at JW Marriott
(Publications Chair). Missing from the picture are Chris Bower (Sr. Past General Orlando, Grande Lakes in Orlando, Florida, between May 30 - June 2,
Chair) and Rozalia Beica, the 2022 ECTC General Chair. 2023 (Figure 4). The Call for Papers can be found at www.ectc.net.
Abstract submission will close October 10, 2022. Plan now to attend
development for young professionals with the participation for in-person sessions, get to know new people, learn where this
of IEEE EPS Board of Governors; and industry is going, and network with your colleagues!
• Heterogeneous Integration Roadmap Workshop
• Sponsored by the IEEE EPS, EDS
and Photonics Societies together with
SEMI and ASME EPPD and chaired
by William Chen of ASE and Bill
Bottoms of MTS, U.S., took place at
our conference with another packed
audience this year as well. Thank you
to the HIR committee for bringing
another excellent workshop to ECTC.

The number of the Technology Corner
Exhibitors has again crossed the 100 mark
with sold-out exhibits and a record level of
industry support with 45 sponsorships and 12
media partners. This is a great indication of the
growing interest in advanced packaging and
the important role ECTC plays in this industry.
ECTC is well known for being a premier,
flagship conference of the advanced packaging
industry and it has successfully delivered to
its name. This year’s event delivered even
more and diversified content while connecting
our community both globally and on site.
Besides the highly technical content of this
conference and several opportunities to learn
and get insights into the latest developments
and trends in microelectronics packaging,
ECTC is also well known for its great
networking events. ECTC 2022 offered over
20 different receptions, the gala, luncheons E-Tec Interconnect AG, Mr. Pablo Rodriguez, Lengnau Switzerland
and various networking events. The feedback Phone : +41 32 654 15 50, E-mail: p.rodriguez@e-tec.com
was overwhelmingly positive. The entire
Executive Committee and I would like to thank

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