Page 50 - Chip Scale Review_Jul Aug_2022-digital

The 72nd IEEE Electronic Components

and Technology Conference (ECTC)

By Rozalia Beica [72nd ECTC General Chair, and AT&S China]

E CTC is the premier international conference on panelists the platform to join us virtually and share with us their

microelectronic packaging, components, and systems
Preparation for ECTC 2022 started almost a year ago and was
technology. The 72nd edition of ECTC was held at expertise, latest developments and industry insights.
Sheraton San Diego Hotel & Marina in San Diego, California, strongly supported by over 250 experts from 15 countries and
USA, from May 31 to June 3, 2022. It was a resounding success! members of 10 technical committees. There were 489 submitted
We had 1,509 attendees from 24 countries. Given the uncertainties abstracts – with equal distribution between industry and academia
with the worldwide pandemic and travel restrictions still in place, – that were critically reviewed by the technical committees,
the attendance significantly surpassed our expectations. We were resulting in 362 technical papers. The papers were organized into 41
glad to bring the conference back to an in-person event and provide sessions that represented speakers from 21 countries, including five
our community the opportunity to meet again. Equally important interactive presentation sessions. One of the interactive sessions was
was for us to also provide options to our colleagues who could not dedicated to students. The most attended topics reflected interests
travel but were still interested in participating. We organized virtual in heterogeneous integration for high-performance computing,
presentations and special sessions giving our technical speakers and automotive and power electronics, 2.5 and 3D integration, fan-out
panel-level packaging, advanced flip-chip and
embedded substrate technologies, and hybrid
and direct bonding, with multiple sessions
Technistrip ® getting over 300 attendees. Supplementing
the technical program and co-located with
the IEEE ITherm Conference, ECTC offered
Superior Photoresist Removers 16 CEU-approved professional development
courses (PDCs).
We were honored to have Chris Koopmans,
More than a decade of industry Chief Operations Officer with Marvell
leadership, service, and support Technology (Figure 1), as our keynote speaker.
Given the changes happening globally,
Technic’s Technistrip series of photoresist removal many enhanced by the growth of digital
®
chemistries have grown to meet evolving demands of transformation, the infrastructure to support
semiconductor fabricators, especially for wafer-level them is becoming increasingly important. It was
packaging applications including RDL, UBM, and a very timely and relevant topic to our industry
Cu pillar processing. and a great example of why and how Marvell
was able to transform itself from a broad,
• Rapid and complete removal of a wide range co n su m e r -
of photoresist materials o r i en te d
company, to
• High materials compatibility with metals an industry-
and compound semiconductor substrates
leading data
• Best-in-class cost of ownership through infrastructure
extended bath life, mild operating conditions, semiconductor
and straightforward rinsing s o l u t i o n s
provider.
• NMP - Free
This year
the conference
i n c l u d e d a
record number
o f o n - s i t e Figure 1: Keynote luncheon
www.technic.com editions of 9 speaker: Chris Koopmans, COO
Marvell Technology.

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48 Chip Scale Review July • August • 2022 [ChipScaleReview.com]