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Conference: October 4-6, 2022
Exhibition: October 4-5, 2022
Professional Development Courses: October 3, 2022
SPONSOR & EXHIBIT SALES The 55 International Symposium on Microelectronics is
th
UNDERWAY! being organized by the International Microelectronics Assembly
and Packaging Society (IMAPS) and held at Hynes Convention
Center. This year’s Symposium will focus on PACKAGING
TECHNOLOGIES ENABLING THE NEW NORMAL, and will
feature 5 technical tracks, plus our Interactive Poster Session.
The technical program will span three days of sessions with
emphasis on packaging technologies that serve 5G, High
Performance Computations, Automotive, Industrial, Defense/
Space, Medical electronics markets, and beyond!
• TRACK 1:
SiP/Design/Manufacturing Optimization
• TRACK 2:
Wafer Level/Panel Level (Advanced RDL)
• TRACK 3:
High Performance / High Reliability
• TRACK 4:
Advanced Package (Flip Chip, 2.5D, 3D, Optical)
For sponsorship information, contact • TRACK 5:
Brian Schieman, Executive Director, bschieman@imaps.org Advanced Process & Materials (Enabling Tech.)
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