Page 54 - Chip Scale Review_Jul Aug_2022-digital

IMAPS Advanced System-in-Package

(SiP) Conference

By Mark Gerber [Advanced SiP 2022 General Chair, and [ASE, Inc.]

O n behalf of IMAPS and the SiP Technical Committee The startup company competition had four companies pitching

we want to thank all the participants, sponsor and
Sivers Semiconductors (Mixcomm). It was a tough competition and
exhibitors for supporting the IMAPS 2022 Advanced their technology: Averatek, Avicena, Mosaic Microsystems and
SiP Conference (held in Sonoma, CA, June 20-23). We received a great we congratulate the winner, Haris Basit with Averatek. Finally, the
deal of positive feedback. A short recap of the event is provided below. day closed with a panel roundtable led by Eelco Bergman (ASE) on
Please reach out to IMAPS if you were not able to attend and would “Chiplet Based Architectures – the Road to Mass Adoption,” where he
like to obtain the presentation materials. hosted four panelists that shared their insights regarding current and
Day 0. We started off with a special heterogeneous integration future challenges with chiplet integration.
roadmap (HIR) workshop with an outstanding list of keynotes and Day 3. The final day began with a keynote from Ming Zhang
invited speakers that covered an intro to HIR, Integrated Photonics, (Synopsys) who presented on the topic of “Conducting the
Automotive Electronics, Thermal Management and Supply Chain. Semiconductors: The Role of Design in the SysMoore Era,” followed
This was followed by three professional development courses (PDCs). by invited speakers John Park (Cadence) and Anthony Mastroianni
The pre-conference event was excellent—special thanks go to Bill (Siemens EDA) who provided their insights related to chiplet
Chen and Bill Bottoms for the HIR workshop. integration, as well as the ecosystem. The last session featured three
Day 1. The first day of the conference kicked off with two speakers on test considerations: Warren Wartel (Amkor), Wei Wang
keynotes. The first was from Chidi Chidambaram (Qualcomm) on (National Instruments), and Ken Lanier (Teradyne).
“System-level Optimization Opportunities and Challenges in the The technical program can be viewed at: https://imaps.org/sip_
Era of Slowing Silicon Process Technology,” which provided a look agenda.php
into the next-generation heterogeneous requirements for the next Stay tuned for next year‘s 2023 IMAPS Advanced SiP Conference
generation of silicon nodes. The second keynote was from Ron Ho and Venue.
(Meta) on the topic of “Silicon SiPs” (system in package) for the
Metaverse in which he outlined a number of key miniaturization
and performance challenges for the augmented reality (AR)/virtual ADVERTISER INDEX
reality (VR) product space. This was followed by a session of
invited speakers, Pouya Talebbeydokhti (Intel), Matthew Poulton Adeia ............................... 38 LB Semicon .............................. 34
(Quoro) and Mohamed Jatlaoui (Murata), who discussed mobile/5G
in the morning. In the afternoon session, the topic was wearables/ Amkor Technology ................... 1 Leeno Industrial .................. IFC, 16
internet of things (IoT) with Curtis Zwenger (Amkor), Mark Poliks ASE, Inc. ....................................... 26 MacDermid Alpha ...................... 44
(Binghamton University) and Szi Pei Lim (Indium Corp.). The day
capped off with a panel session led by Jan Vardaman (TechSearch Brewer Science ......................... 37 MRSI Systems .............................. 45
International) on “Remaining Challenges in the Adoption of 5G,”
in which several panelists participated including myself, Curtis CyberOptics .............................. OBC Plasma Etch ................................ 41
Zwenger and Matthew Poulton. It was a lively discussion around DL Technology ....................... 40 SCREEN Holdings Co., Ltd. ........ 14
why there still seems to be some challenges with 5G for both
mmWave and sub-6G frequencies. E-tec Interconnect ...................... 51 SEMI ........................................... 47
Day 2. The Khai Nguyen (Nvidia) keynote, “Trends and Reliability
Challenges in Advanced Driving Assistance System (ADAS),” ECTC ...................................... 46 Smiths Interconnect .................... 11
provided insight into key considerations for current and next-
generation ADAS systems that may use complex modules. Anindya EV Group ................................ 2 Sonix ........................................... 49
Poddar (Texas Instruments) gave a presentation on “The Automotive FormFactor ............................ 32 SÜSS MicroTec ........................... 43
Package Ecosystem.” This keynote emphasized the need and value of
heterogeneous integration and system solutions moving forward, and IMAPS ......................................... 50 Technic ...................................... 48
the key ecosystem players that will be critical to enable. An invited
speaker session followed on the topic of high-performance computing INTEKPLUS CO., LTD. ............... 19 Test Tooling Solutions Group .... 22
(HPC)/co-packaged optics (CPO) with talks covering next-generation Ironwood Electronics ................ 25 TSE Co. Ltd ................................. 4,5
advanced fan-out embedded bridge featuring Lihon Cao (ASE),
hybrid bonding by Robert Patti (Nhanced Semi), and the path to sub- ITW EAE ...................................... 30 WinWay Technology ...................... 6
fJ/Bit interconnect by Daniel Graf (Zero EC). The afternoon focused
on automotive and power topics with invited speakers Hongbin Yu ISC CO., LTD. .............................. 9 Yield Engineering Systems ......... 29
(Arizona State University) on “Automotive Power Delivery,” Pradeep Johnstech International .......... IBC
Lall (Auburn University) on “FCBGA [flip-chip ball grid array]
Underfill Materials for Automotive,” and Mike Marczi (Marel Power) September October 2022
with a talk on packaging beyond 100kW/L. Space Close September 6th • Ad Materials Close September 9th
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