Page 42 - Chip Scale Review_Jul Aug_2022-digital

FOWLP is an enhanced version of wafer- with finer-pitch chip interconnects on large- application. For example, SHF may be
level packaging (WLP) that packages format panels for cost reductions. With both sandwiched between a die and a non-
integrated circuits (ICs) directly on the FOWLP and FOPLP packages, SHF sheets flat substrate while DAF is sandwiched
semiconductor wafer and supports products can encapsulate multiple dies and conform between two dies of different sizes as
with smaller footprints and improved to irregular substrates. die-stacking. Cured silicone DAF (see
thermal and electrical performance. FOPLP Sometimes, both SHF sheets and Figure 1) has a three-layer construction
can accommodate larger package sizes cured silicone DAF are used in the same with a thin film sandwiched between two
release liners and, when applied, a relatively
thick bond line (25µm to 300µm) with
excellent uniformity. Reliable adhesion
and excellent stress decoupling for CTE
mismatches are also advantages. In addition,
cured silicone DAF eliminates fillet and
bleed-out, problems that can interfere with
adhesion. To support processing, the product
can be diced into small squares with sizes
LEADERS IN such as 1mm x 1mm.
Silicone hotmelts offer important benefits,
MICRO DISPENSING but these solid materials are not the only
advanced silicones that can address today’s
TECHNOLOGY

SMALL REPEATABLE VOLUMES
ARE A CHALLENGE, BUT NOT
IMPOSSIBLE IF YOU HAVE BEEN
CREATING THEM AS LONG AS WE HAVE.

TO DO IT WELL,
WE PROVIDE THREE THINGS:

Dispensing Expertise in a variety of microelectronic
packaging applications.

Feasibility Testing & Process Verification based Figure 1: Cured silicone die attached film (DAF).
on years of product engineering, material flow testing
and software control. semiconductor packaging challenges. Like
silicone hot-melt films, silicone hot-melt
Product Development for patented valves, cartridges (SHC) provide better workability
dispensing cartridges, needles, and accessories. and thermal stability than commercial
liquid silicone. Although SHF and SHC are
both used for chip encapsulation and over
large areas, SHC supports hot dispensing,
slit-die coating, and compression molding
for processing. SHC can also be used for
molded underfill (MUF) encapsulation,
Our Micro Dispensing product line is proven and trusted by filling the narrow gaps under flip-chips and
manufacturers in semiconductor, electronics assembly, medical
device and electro-mechanical assembly the world over. overmolding dies at the same time.
Hot dispensing involves heating the solid
www.dltechnology.com.
contents of a silicone hot-melt cartridge and
then dispensing a liquified melt through
216 River Street, Haverhill, MA 01832 • P: 978.374.6451 • F: 978.372.4889 • info@dltechnology.com a syringe. This process fills gaps reliably
and supports direct bonding without any

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40 Chip Scale Review July • August • 2022 [ChipScaleReview.com]