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Figure 5: Measurement results a) realized gain, and b) return loss, match simulation results after the LTCC substrate was fired.
Figure 6: a) (left) Surface-mounted IC chips, and b) fired LTCC substrate.
Figure 7: A LTCC AiP module installed into a device.
FEM are key to achieving high 5G
performance efficiency at low levels of
power consumption. The outcome of
our LTCC testing—showing its ability
to maintain good thermal stability and
heat performance while significantly
reducing insertion loss—opens the
door to developing new AiP substrates
in which their size is reduced along
Figure 8: EVM testing result. with signal loss.
Summary
LTCC materials deliver both superior
environmental tolerance and a high level
of design freedom in high-frequency
applications. These materials could
play an important role in advancing
instant communication for autonomous
vehicles that talk to each other, as well
as for applications for 5G mmWave band
Figure 9: Signal testing showed that antenna prototypes made with DuPont™ GreenTape™ have low loss and communications, military operations,
provide clean image and audio transmission of high-resolution video files. remote surgery, robotics, and more.
Biography
Andy Kao is a Global Telecom Segment Leader at DuPont Microcircuit and Component Materials in Taiwan
where he develops new solutions for 5G and high-frequency applications. He received a Master’s degree in
Material Science from National Taiwan U. Email: Andy.Kao@dupont.com
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