Page 18 - Chip Scale Review_March April_2022-digital

Session #7 (ECTC Plenary Session) will We are continuing our tradition and The ECTC Diversity Panel (Session #6) –
focus on the important topic of “Digital bringing back the young professionals started a few years ago as a women-focused
Transformation - The Cornerstone of Future networking event (Session #9). This is a great panel – has now evolved into a Diversity and
Semiconductor and Advanced Packaging networking opportunity for young engineers, Career Panel. Its focus will be on “Solving
Growth.” The session will be chaired researchers, and students, to meet senior EPS Diversification Challenges and Workforce
by the IEEE ECTC 2022 general chair, members and professionals, learn more about Retention Issues.” Our colleagues from
Rozalia Beica (AT&S), and Ed Sperling industry activities, receive career guidance, Japan will be chairing this year’s IEEE EPS
(Semiconductor Engineering). and engage through a series of activities. seminar Session #4, which will focus on
“Interconnect Technologies for Chiplets.”
Laser Assisted Bonding Following the industry trends and a
growing interest in Micro-LED, ECTC
2022 will feature a special session (Session
#1) on “Micro-LED Display Technologies.”
ECTC Special Session #2 will highlight the
IEEE EPS Hetero Integration Roadmap and
will present special topics from the HIR
working groups.
ECTC Special Session #3 will focus
on “Meeting Next Generation Packaging
Challenges: Chiplets to Co-Packaged
Optics.” ECTC Special Session #4 will
cover the topic, “How will IC substrate
Global Services for technology evolve to enable next generation
Heterogeneous Integration schemes for high
performance applications?” In addition to
Wafer Level Packaging the technical and special sessions and panels,
the 72nd ECTC event will again offer the
professional development courses (PDCs)
Electroless Plating and the Technology Corner exhibits. This
year, 14 PDCs organized by PDC Committee
• NiAu for Low Cost Bumping
• High Reliability NiPdAu chairs, Kitty Pearsall and Jeffrey Suhling,
• Cu & Au Wire Bonding will be offered. The return to a live event
also means that our Technology Corner
Electroplating will return to a newly renovated exhibition
space with over 100 companies representing
• Wafer Level Redistribution
• Cu Pillars the full spectrum of materials, services,
• NiFe for MEMS equipment, and products for the electronic
packaging industry. Remaining exhibit space
is currently very limited, but there is still
Solder Ball Bumping
time to reserve a booth for 2022.
• 4”-12” Wafers Whether you are an engineer, a manager,
• BGA-like devices
• 3D-Applications a student, or a business and marketing
professional or an executive, ECTC offers
something unique for everyone in the
Solder Rework & Reballing
microelectronics packaging and components
• for CSP, BGA, LGA, CLCC, PCB, industry. As the Program Chair, I invite
MEMS etc.
• No Tooling Required you to make your plans now to join us
and be a part of all the exciting technical
and professional opportunities offered at
Wafer Backend Processing this event. I would also like to take this
• Backside Metallization opportunity to thank our sponsors, exhibitors,
• Thinning & Dicing authors, speakers, PDC instructors, session
• Tape & Reel
chairs, and program committee members,
as well as all the volunteers who help make
the 72nd ECTC a success. I look forward to
sales@pactech.com meeting all of you again in person on May 31,
www.pactech.com 2022 in San Diego.

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