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INDUSTRY NEWS

ECTC 2022 will bring key technologists/

scientists together – in-person!

By Karlheinz Bock, TU Dresden, 72nd ECTC Program Chair

O n behalf of the Program and scaling. More than 200 experts from broad their abstracts and are now getting ready

to submit their completed manuscripts.
Executive Committees, it
ranging technical areas have put together an
is my pleasure to invite you
ongoing technology developments within
350 technical papers in 41 technical sessions,
to IEEE’s 72nd Electronic exceptional program consisting of more than These submissions for the 72nd ECTC cover
Components and Technology Conference 14 Professional Development Courses established disciplines, or emerging topics of
(ECTC). We are very excited about the and several panels, special sessions, and interest for our industry.
ECTC 2022 program and welcome our networking opportunities. The conference Chris Koopmans – Chief Operations
colleagues from all over the world to join us. will address various important topics and Officer of Marvell – will deliver the invited
The 72nd edition of ECTC, sponsored by industry trends, from mobile, 5G, medical keynote speech entitled, “Accelerating the
IEEE/EPS, will take place in San Diego, CA, wearables and automotive applications power of data infrastructure with cloud-
U.S.A., from May 31-June 3, 2022. including autonomous driving, flexible optimized silicon.” The keynote will share
Considered the premier electronic and printed electronics, to high-speed insights into how data infrastructure is
packaging conference of the industry, ECTC communications, wireless, LiFi, photonics, converging into the cloud, the emerging
is continuing its tradition of bringing the high-performance and quantum computing, cloud-optimized silicon era, and the
latest developments in integrated circuit (IC) and artificial intelligence (AI) hardware. The technology areas the industry must tackle to
packaging, components, and microelectronic technical presentations and panel discussions accelerate the power of data infrastructure
system technologies. This annual will feature a wide range of packaging with cloud-optimized silicon.
international conference brings together key technologies, from wire bonding, wafer- and The in-person conference has been
stakeholders of the global microelectronic panel-level packaging, flip chip, 2.5D and extended to 9 special sessions (see Table 1)
packaging industry, such as semiconductor 3D integration, to advanced substrates and with invited industry experts that will cover
and electronics manufacturing companies, interposers, embedded technologies, system emerging technologies and applications as
design houses and foundries, outsourced in package and heterogeneous integration. noted below.
semiconductor assembly and test (OSAT) New ideas, designs, characterizations, Session #5 (IEEE EPS President’s
service providers, substrate makers, simulations and reliability studies will Panel) will address the “State-of-the-
equipment manufacturers, material suppliers, bring new perspectives and challenges Art Heterogeneous Integrated Packaging
research institutions, and universities—all with respect to materials and processing, Program - SHIP Projekt with DoD,” and will
under one roof. ECTC typically attracts more integration, interconnections, assembly and be chaired by EPS president Kitty Pearsall
than 1,500 attendees from over 25 countries. manufacturing. More than 350 authors from (Boss Precision, Inc.) and Chris Riso (Booz
Last year’s 71st ECTC, was held virtually on over 25 countries have already submitted Allan Hamilton).
the Engagez platform of MCE because of the
pandemic. The virtual conference had 1,380
attendees from more than 55 countries around
the world with 350 video presentations
featured in 46 technical and interactive
presentation sessions. The virtual ECTC
2021 event also presented virtual exhibitions
on the Engagez platform. Furthermore,
14 special sessions were organized with a
broad spectrum of electronics packaging-
related hot topics based on more than 50
invited expert presentations for the virtual
ECTC 2021 event.
The 72nd ECTC in-person conference will
continue with the same tradition of being
the premium venue to showcase all the latest
developments in the electronic components
industry where packaging has become a way
to achieve device and system performance
Table 1: ECTC 2022 special sessions topics.

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