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New Advanced Bonding Technologies

LAPLACE “3.5D” Laser Assisted Chip Packaging

• vertical connection of chip to die stack (”3.5D”)

• 3D horizontal die stacking
• omitting TSV-VIA structures
• laser reflow for lowest thermal and mechanical stress
• compatible with solder, pillars, ACF, sinter paste
• supporting heterogeneous integration roadmap by

horizontal and vertical bonding of MEMS, ASICs,
interposer, heat sinks, electromagnetic shielding, etc.
• selective chip repair

SB²-WB Wire-Solder-Bonding

• reliable laser-soldered wire connections for

multifunctional systems and modules
• no pressure, vibration or high temperature required
• heavy & fine wires: wire bundles, ribbons, optical fibres
• wide range of materials: Au, Ag, Cu, Pd, Pt, etc.
• flat point-to-point connection

• ideal solution for thin, soft and brittle substrates:
VCSEL, GaN, glass, MEMS, etc.
• easy damaged-free UBM interface

ISO 9001 www.pactech.com
IATF 16949
ISO 14001 sales@pactech.com