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undergoing UV curing, thereby providing Ball Placement & Laser Soldering
high dimensional stability. The epoxy
also provided an excellent compatibility
with the working stamp materials, thereby
enabling a defect-free demolding of the
cured monolithic lens array after the
imprint process. In conclusion, we have
demonstrated the capability of SUSS
UV-imprint lithography and an optically
tailored, UV-curable epoxy resin from
DELO to manufacture freestanding,
double-sided monolithic wafer-level
optics. Therefore, wafer-level fabrication
technology allows the manufacture of 3D Soldering BGA Soldering
thousands of high-quality microlens arrays
on one wafer at very attractive costs and
high throughput.

References
1. R. Voelkeli, K. J. Weible, M. Eisner,
“Wafer-level microoptics: trends
in manufacturing, testing and
packaging,” Proc. of the SPIE, Vol.
8169 81690C-1, (2011).
2. S. M. Kim, H. Kim, J. Lim, J. Han,
S. Kang, “Design and fabrication of Presoldering of SMD Lid Sealing for Connectors
microlens array for VCSEL to fiber Connector Elements & IR Sensors
coupling,” Proc. of the SPIE, Optifab,
Vol. 10315, (2005).
3. G.-K. Lau, M. Shrestha, “Ink-jet
printing of microelectromechanical
systems (MEMS),” Micromachines,
doi: 10.3390/mi8060194 (2017).
4. E. Storace, “Suss Smile Technology
– Large area imprint, a solution
for patterning of micro and nano
features,” SUSS report (2014).
5. K. Schindler, U. Leischner, P. Kaiser,
T. Striebel, U. Schömbs, C. lopper, Optoelectronics Device Assembly Through Hole Technology
“High intensity UV-LED mask aligner Soldering
for applications in industrial research,”
SUSS report (2017).
6. M. Brehm, C. Ertl, I. Pilottek, P.
Heissler, “UV curing materials for
wafer-level optics,” Proc. of the SPIE www.pactech.de
Adv. Fabrication Tech. for Micro/Nano sales@pactech.de
Optics and Photonics XIII (2020).

Biographies
VijayRamya Kolli is Program Manager, Imprint Technologies at, SUSS MicroTec, Garching, Germany. After
she received her PhD in microelectronics engineering from University of Kassel, she joined SUSS in 2015
as an applications engineer for imprint technologies, where she has been responsible for demonstration and
development of customer relevant Micro & Nano imprint processes. In 2021, she took over the role as a program
manager, leading various imprint projects, providing technical sales support and customer analysis to deliver
innovative solutions for technical challenges. Email vijaramya.kolli@suss.com

Markus Brehm is Senior Application Engineer at DELO Industrial Adhesives, Windach, Germany. His focus is on materials
and process for wafer-level microoptics and he has over 12 years of experience in this field. He graduated in Physics from U. of
Heidelberg (Germany) and received his PhD in 2006 from Technical U. of Munich (Germany).

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