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Figure 9: MEMS coaxial probe head transmission and reflection loss.

Figure 10: MEMS impedance matching reflection loss example.
stack-up design include the length of the technologies is paramount. The rapid References
probes, probe diameters, and dielectric pace of growth that the semiconductor 1. K. Maniar, “A revolutionary MEMS
constant. From our experience, reflection industry is experiencing is only expected RF hybrid probe card,” Too Hot to
loss is improved when using a variety of to accelerate and it is up to probe card Test Workshop, MEPTEC 2021.
probe diameters. Figure 10 illustrates the companies to ensure that test technologies 2. Y. C h e n , S . S e j a s - G a r c i a ,
reflection loss of assorted-sized signal and keep up. The entire test process must evolve “Impedance matching for achieving
ground probes at 50GHz [2, 3]. to create the ultimate user experience, a transparent probe head,” SWTest
making sure that the technical, mechanical, Untethered Poster, 2020.
Summary and electronic requirements are met, while 3. S. Sejas-Garcia, “Design strategy
The focus must always be on what ensuring the lowest cost of test possible. for achieving a transparent probe-
is coming next and exploring new Semiconductor manufacturers and tech head,” TestConX, 2021.
concepts; additionally, improving existing consumers are counting on it.

Biography
Raymond (Ray) W. Grimm is President & CEO at Nidec SV TCL, Tempe, Arizona. Throughout his
twenty-year semiconductor test career, he has been a consistent, customer-focused leader, managing the
shift towards advanced test including the move to MEMS technologies. He began as an account manager
for probe card manufacturer, Cerprobe Corporation, and his path continued with increasing responsibilities
in sales management roles at Kulicke and Soffa (Cerprobe), SV Probe, Technoprobe, and Nidec SV TCL.
Email rwgrimm@nidecsvtcl.com

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