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hear from several leading companies who professional or an executive, ECTC offers this opportunity to thank our sponsors,
will discuss their future vision for advanced something unique for everyone in the exhibitors, authors, speakers, PDC
electronics packaging. microelectronics packaging and components instructors, session chairs, and program
We are continuing our tradition and industry. As the Program Chair, I invite committee members, as well as all the
bringing back the young professionals you to make your plans now to join us volunteers who help make the 71st ECTC a
networking event (Session #5). This is a and be a part of all the exciting technical success. I look forward to virtually meeting
great networking opportunity for young and professional opportunities offered all of you on June 1, 2021.
engineers, researchers, and students, to meet at this event. I would also like to take
senior EPS members and professionals,
learn more about industry activities, receive
career guidance, and engage through a
series of activities. The ECTC Diversity
Panel (Session #4) – started a few years
ago as a women-focused panel – has now
evolved into a Diversity and Career Panel.
Its focus will be on the correlation between
diversity in the workplace and enhanced
business performance. This year’s ECTC
Plenary Session (#3) will address the
evolution and challenges of our industry in
light of the pandemic, and the expectations
that will drive packaging developments in
the future. Our colleagues from Japan will
be chairing Session #6, which will focus on
the permissible latency in certain systems,
and how high-bandwidth optical networks
are critically important for satisfying
latency requirements.
Following the industry trends and a
growing interest in photonics, ECTC 2021
will feature a special session (Session #7) in
which a panel of experts will provide their
perspectives on the studies and technological
improvements needed for safely detecting
and eradicating pathogens on surfaces and
spaces. A reliability-focused ECTC Special
Session #8 will highlight LTS research areas
most critical to component suppliers to
improve compatibility with surface mount
technology (SMT) LTS processing and to
enhance solder joint reliability.
ECTC Special Session #9 will focus
on some of the challenges associated with
packaging sensors and the electronic signal
chain into these emerging, at-home clinical-
grade wearables. ECTC Special Session #10
will cover materials and technologies for
advanced packaging.
In addition to the technical and special
sessions and panels, the 71st ECTC event
will offer several professional development
courses (PDCs) and Technology Corner
exhibits. Fourteen PDCs organized by PDC
Committee chairs, Kitty Pearsall and Jeffrey
Suhling, will be offered.
Whether you are an engineer, a manager,
a student, or a business and marketing

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