Page 11 - ChipScale_Mar-Apr_2021-digital

Solutions for
S ol u t io ns f o r

Miniaturization IoT
and

5 nm
Leading-edge Devices size 300 mm
Wafer

7 nm

10 nm

SU-3300 SB-3300 NEW DT-3000
Single Wafer Cleaner Wafer Back-side Cleaning System Coat/Develop Track

14 nm

28 nm SP-2100 NEW
Spin Processor
LA-3100 RE-3500
Flash Lamp Annealer Ellipsometric Film Thickness
Measurement System
45 nm

SS-80EX CW-2000
65 nm Spin Scrubber Compact Wet Station

ZI-3500
Wafer Pattern
Inspection System 90 nm

VM-2500 SK-80EX DW-6000
130 nm
Spectroscopic Film Thickness Coat/Develop Track Direct Imaging System for
Measurement System Panel Level Packages
IoT Applications size 200 mm
Wafer

250 nm Power SAW CMOS
Device Device LED Sensor MEMS

High-throughput flexible direct imaging
for packaging/MEMS fabrication
As featured in Chip Scale Review January-February 2021 issue