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INDUSTRY NEWS

ECTC 2021 will bring key technologists

and scientists together – virtually

By Ibrahim Guven, Virginia Commonwealth University, 71st ECTC Program Chair
O n behalf of the Program and and several panels, special sessions, and teleconferencing meeting for each session

will be held by the session chairs; all the
Executive Committees, it
networking opportunities. The conference
is my pleasure to invite you
industry trends, from mobile, 5G, medical
live to field questions from the attendees.
to IEEE’s 71st Electronic will address various important topics and presenters in the session will be available
Components and Technology Conference wearables and automotive applications The special sessions will be held in a slightly
(ECTC). We are very excited about the 2021 including autonomous driving, flexible different manner (see the Table). Special
program and welcome our colleagues from and printed electronics, to high-speed sessions will be held live during the first two
all over the world to join us. The 71st edition communications, wireless, LiFi, photonics, weeks of the conference. Each panelist will
of ECTC, sponsored by IEEE/EPS, will take high-performance and quantum computing, pre-record their talks for the session; these
place virtually from June 1 until July 4, 2021. and artificial intelligence (AI) hardware. The talks will be broadcast live and immediately
Considered the premier electronic technical presentations and panel discussions followed by a live panel discussion during
packaging conference of the industry, will feature a wide range of packaging which attendees will be able to ask questions.
ECTC is continuing its tradition of bringing technologies, from wire bonding, wafer- and The special sessions will be recorded and
the latest developments in IC packaging, panel-level packaging, flip chip, 2.5D and made available for on-demand streaming
components, and microelectronic system 3D integration, to advanced substrates and from the date of the session until the end of
technologies. This annual international interposers, embedded technologies, system the conference.
conference brings together key stakeholders in package and heterogeneous integration. Sam Naffziger, Senior Vice President
of the global microelectronic packaging New ideas, designs, characterizations, of AMD, will deliver the keynote speech
industry, such as semiconductor and simulations and reliability studies will entitled, “What the Chiplet-Based Future
electronics manufacturing companies, bring new perspectives and challenges of Compute Means for Components and
design houses and foundries, outsourced with respect to materials and processing, Technology.” The conference will also
semiconductor assembly and test (OSAT) integration, interconnections, assembly and feature a record ten special sessions (see
service providers, substrate makers, manufacturing. Authors from over twenty- the Table) with invited industry experts
equipment manufacturers, material suppliers, five countries are expected to present their that will cover emerging technologies and
research institutions, and universities—all work at the 71st ECTC, covering ongoing applications. Session #2 will address market
under one roof. ECTC typically attracts more technology developments within established trends in the semiconductor industry,
than 1,500 attendees from over 25 countries. disciplines or emerging topics of interest for emerging applications, economic and
Last year’s 70th ECTC, originally scheduled our industry. geopolitical uncertainties, and the impact on
to be held in-person in Lake Buena Vista, The virtual platform will allow for the global supply chain for microelectronics
Florida, was converted to an online platform recorded presentations of all technical packaging. Session #1 will be chaired by
because of the pandemic. The virtual session talks to be available on-demand IEEE EPS President, Christopher Bailey, and
conference had over 7,500 attendees from throughout the conference. During the IEEE EPS Vice President of Conferences,
more than 55 countries around the world last two weeks of the conference, a live Sam Karikalan. Attendees of Session #1 will
with 346 video presentations featured
in 45 technical sessions. Additionally,
there were seven special sessions with 60
invited presentations.
The 71st ECTC will continue with the
same tradition of being the premium venue
to showcase all the latest developments
in the electronic components industry
where packaging has become a way to
achieve device and system performance
scaling. More than 200 experts from broad-
ranging technical areas have put together an
exceptional program consisting of more than
350 technical papers in 46 technical sessions,
14 Professional Development Courses

6 6 Chip Scale Review March • April • 2021 [ChipScaleReview.com]