Page 5 - ChipScale_Mar-Apr_2021-digital

The Future of Semiconductor Packaging

STAFF Volume 25, Number 2
Kim Newman Publisher March • April 2021
knewman@chipscalereview.com
Lawrence Michaels Managing Director/Editor
lmichaels@chipscalereview.com FEATURE ARTICLES (continued)
Debra Vogler Senior Technical Editor
dvogler@chipscalereview.com
22 Enabling wafer thinning using a
CONTRIBUTING EDITORS glass carrier
Steffen Kröhnert - Advanced Packaging By Julia Brueckner, Andreas Gaab, Steven Lin, Erica
DIE-TO-WAFER (D2W) steffen.kroehnert@espat-consulting.com Chang, Toshihiko Ono, Varun Singh, Jay Zhang
John L. Lau, Ph.D - Advanced Packaging
[Corning Incorporated]
john_lau@unimicron.com
BONDING SOLUTIONS Ephraim Suhir, Ph.D - Reliability Sebastian Tussing, Walter Spiess
[SÜSS MicroTec]
suhire@aol.com
Rao R. Tummala, Ph.D - Advanced Packaging
rao.tummala@ece.gatech.edu 28 Automating RF PA device manufacturing to
accelerate 5G wireless rollout
EDITORIAL ADVISORS By Limin Zhou, Julius Ortega
Andy Mackie, Ph.D (Chair) - Indium Corporation [MRSI Systems, Mycronic Group]
Rolf Aschenbrenner, Dipl.-Phys. - Fraunhofer IZM
Arun Gowda, Ph.D - GE Global Research 35 Packaging trends for automotive
John Lau, Ph.D - Unimicron LIDAR applications
Leon Lin Tingyu, Ph.D - National Center for Advanced
Packaging (NCAP China) By Ajay Sattu, Weilung Lu, Mike Sleiman, Burt Barber
[Amkor Technology, Inc]
Fusion and hybrid bonding for next-generation SUBSCRIPTION—INQUIRIES
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Direct placement D2W activation and cleaning lmichaels@chipscalereview.com 48 Silicon die bonding using a
complete solution with EVG®320 D2W Copyright © 2021 Haley Publishing Inc. photostructurable adhesive material
Chip Scale Review (ISSN 1526-1344) is a registered trademark of By Kai Hollstein, Kirsten Weide-Zaage
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