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CONTENTS
March • April 2021 DEPARTMENTS
Volume 25, Number 2
6 INDUSTRY NEWS
ECTC 2021 will bring key technologists
and scientists together – virtually
By Ibrahim Guven, 71st ECTC Program Chair
[Virginia Commonwealth University]
FEATURE ARTICLES
CEA and IRT Nanoelec demonstrate a chiplet- 8 Heterogeneous 3D integration for
based Active Interposer proof-of-concept, high-performance computing
IntAct. Using advanced 3D technologies,
such as TSV-middle and fine-pitch die-to- By Séverine Chéramy, Emilie Bourjot
die interconnect, the IntAct demonstrator [CEA-Leti]
exhibits state-of-the art performance. 150,000 Johanna M. Swan
die-to-die interconnects are used, mostly for [Intel]
power and grounds, while 30,000 µbumps
are used for 3D plug connectivity delivering Fan-out embedded bridge packaging for
2
throughput density up to 3TBit/s/mm . This 16
circuit implements 96 cores with a scalable cost-effective chiplet integration
cache coherent architecture, delivering 220 By C. Key Chung, Shuai-Lin Liu, Jackson Li
GOPS peak. [Siliconware Precision Industries Co., Ltd.]
Photo courtesy of CEA-Leti
Chip Scale Review March • April • 2021 [ChipScaleReview.com] 1 1
