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Figure 7: Successful debonding using a mechanical debonder. The carrier can
be reused.

Figure 8: Schematic illustration of glass bending during debonding.

be monitored. In the next step, the device wafer is attached to the
dicing tape before the final mechanical debonding process takes
place. Finally, mechanical debonding is performed on a SUSS
XBC300 Gen2 mechanical debonding system. This is a critical
part of the study that needs to be established for a glass carrier to
succeed as a material for mechanical debonding processes. Here,
the wafer stack is placed with the silicon side on a vacuum chuck.
A wedge-shaped initiator is used to initiate the separation between
the carrier and device wafer. The initiator is lifted and positioned
at a specific height, h. A flex plate is placed on top of the glass
carrier, and with the help of a roller that moves away from the
initiator point, the debonding continues until the carrier is fully
separated. Figure 6 shows a picture of the debonding tool, as well
as a schematic showing the flex plate in action. Please refer to the
stress calculation in the sub-section entitled “Stress calculation”
that shows that the induced stress is much lower than the strength
of the glass. The result shows the thinned device on tape and the

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