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Testing AiP modules in high-volume production for


        5G applications


        By Jose Moreira  [Advantest]
        T        his article is a follow up   a 0.4mm pitch for the BGA array on the   that AiP modules come in a multitude




                                           bottom of the PCB. The objective was not
                 to a r t icle [1] where we
                                                                              of package types [3]. We chose this one
                 described different options
                 for high-volume over the air   to create a 5G-compliant antenna array,   because it was the simplest to design
                                                                              and manufacture.
                                           but just a demonstration vehicle. Note
        (OTA) testing of antenna in package
        (AiP) modules with automated test
        equipment (ATE). We also presented
        a high-level compar ison of their
        advantages and disadvantages. In
        this follow-up article we will present
        measurement results for two of the
        presented OTA testing approaches:
        far-field and radiating near-field OTA.
        But before we go to the measurement
        results, we need to first define an AiP
        device under test (DUT) that can be
        used as a DUT for the measurements.

        Creating an AiP evaluation vehicle
          To properly evaluate an ATE OTA
        measurement setup, it is critical to use
        an AiP module. Using, for example,   Figure 1: Simple antenna in package module demonstration vehicle for OTA measurements.
        a reference antenna instead of an AiP
        DUT (e.g., a reference horn antenna)
        would not take into account all the
        components that are specific to an
        ATE implementation like the DUT test
        fixture printed circuit board (PCB) or
        the DUT socket. Using a commercial
        AiP module is also not currently a
        feasible option because there are
        very few commercially-available AiP
        modules and there would always be
        intellectual property (IP) restrictions
        on using them to publicly show OTA
        measurement results.
          Because of the reasons cited above,
        we decided to create the simple AiP
        module shown in Figure 1. The module
        was manufactured in a multilayer PCB
        with a Rogers 4350B top layer and a ball
        grid array (BGA) on the bottom. The
        antenna array comprises a 2 by 2 array of
        dual polarized patch antennas [2]. They
        are a microstrip feed with two quarter-
        wavelength transformers for impedance
        matching. This antenna design is narrow
        band, and it was tuned for 28GHz, but
        can support our measurement modulation
        range, which will be 100MHz. We used   Figure 2: Socket lid impact in the AiP module antenna array beam: a) (top) without a lid, and b) (bottom) with a lid.

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