Page 5 - ChipScale_Jul-Aug_2020-Digital

The Future of Semiconductor Packaging

STAFF Volume 24, Number 4
Kim Newman Publisher July • August 2020
knewman@chipscalereview.com
Lawrence Michaels Managing Director/Editor
lmichaels@chipscalereview.com
Debra Vogler Senior Technical Editor FEATURE ARTICLES
dvogler@chipscalereview.com
CONTRIBUTING EDITORS 16 Advanced RF packaging technology
ACCELERATING Steffen Kröhnert - Advanced Packaging trends, from GSM to 5G
steffen.kroehnert@espat-consulting.com
John L. Lau, Ph.D - Advanced Packaging
HETEROGENEOUS john_lau@unimicron.com By Stéphane Elisabeth
[System Plus Consulting]
Ephraim Suhir, Ph.D - Reliability
suhire@aol.com
INTEGRATION Rao R. Tummala, Ph.D - Advanced Packaging 20 Materials and solutions for power package
rao.tummala@ece.gatech.edu

EDITORIAL ADVISORS die bonding
Andy Mackie, Ph.D (Chair) - Indium Corporation
Rolf Aschenbrenner, Dipl.-Phys. - Fraunhofer IZM By Jonathan Abdilla
Arun Gowda, Ph.D - GE Global Research [Besi Austria GmbH]
John Lau, Ph.D - Unimicron Maurizio Fenech
Leon Lin Tingyu, Ph.D - National Center for Advanced [MacDermid Alpha Assembly Solutions]
Packaging (NCAP China)

SUBSCRIPTION—INQUIRIES
Chip Scale Review 26 Achieving less than 1% voiding in GaN die
All subscription changes, additions, deletions to any attach processing
and all subscriptions should be made by email only to By Alex Voronel, Pierino Zappella
subs@chipscalereview.com [SST Vacuum Reflow Systems, a Palomar Solution]

Advertising Production Inquiries:
Lawrence Michaels 37 High-throughput, high-accuracy
EV Group establishes Heterogeneous Integration Competence Center™ to accelerate lmichaels@chipscalereview.com flip-chip bonding
new product development fueled by heterogeneous integration and advanced packaging By Horst Clauberg
Copyright © 2020 Haley Publishing Inc. [Kulicke & Soffa Industries Inc.]
Chip Scale Review (ISSN 1526-1344) is a registered trademark of
Haley Publishing Inc. All rights reserved.
Open access innovation incubator for EVG customers and partners across the Subscriptions in the U.S. are available without charge to qualified individuals
microelectronics supply chain, guaranteeing the highest IP protection standards in the electronics industry. In the U.S. subscriptions by first class mail are
$125 per year. Subscriptions outside of the United States are $225 per year 43 System in package: a way forward for
to other countries.
system integration
Combining EVG’s world-class wafer bonding, thin-wafer handling and lithography Chip Scale Review, (ISSN 1526-1344), is published six times a By Favier Shoo, Santosh Kumar
year with issues in January-February, March-April, May-June, July-
products and expertise, as well as pilot-line production facilities and services August, September-October and November-December. Periodical [Yole Développement]
postage paid at Los Angeles, Calif., and additional offices.
POSTMASTER: Send address changes to Chip Scale Review magazine
P.O. Box 2165, Morgan Hill, CA 95038
Leveraging the state-of-the-art cleanroom facilities at EVG’s headquarters in Austria, Printed in the United States
supported by EVG’s worldwide network of process technology teams

VISIT US AT Official Publication Sponsor

Official Media Sponsor

SEPT 23-25, 2020
GET IN TOUCH to discuss your manufacturing needs
HeterogeneousIntegration@EVGroup.com Booth: #L0316 Co-Host & Organizer
Chip Scale Review July • August • 2020 [ChipScaleReview.com] 3 3