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ACCELERATING


                     HETEROGENEOUS


                              INTEGRATION























                   EV Group establishes Heterogeneous Integration Competence Center™ to accelerate
                   new product development fueled by heterogeneous integration and advanced packaging


                   Open access innovation incubator for EVG customers and partners across the
                   microelectronics supply chain, guaranteeing the highest IP protection standards


                   Combining EVG’s world-class wafer bonding, thin-wafer handling and lithography
                   products and expertise, as well as pilot-line production facilities and services


                   Leveraging the state-of-the-art cleanroom facilities at EVG’s headquarters in Austria,
                   supported by EVG’s worldwide network of process technology teams





                                                                                  VISIT US AT







                                                                                     SEPT 23-25, 2020
       GET IN TOUCH to discuss your manufacturing needs
       HeterogeneousIntegration@EVGroup.com                                              Booth: #L0316
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